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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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Investigation of Reliability for Solder Joints in Nitrogen Atmosphere
Vala, Martin ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This thesis examines the influence of nitrogen atmosphere on the quality of the solder joint lead-free solder paste. For the solder paste were measured and set temperature profiles. Thesis includes the implementation and measurement of samples in a protective nitrogen atmosphere and without a protective atmosphere. These measurements are compared, and the conclusions were drawn for the influence of nitrogen atmosphere. The reliability and the quality of the soldered joints were investigated.
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Mechanical testing of electronics assemblies by vibration
Pešina, Tomáš ; Otáhal, Alexandr (referee) ; Szendiuch, Ivan (advisor)
Content of this work is oriented on mechanical testing of PWB. Deals with standards related to mechanical testing and quality evaluation of PWB. This works is engaged into industry standards, for example IPC or JEDEC. Studies principle and methods of chosen vibration tests. Further aim of this work is vibration fundamentals of PWB assembly. This work describes some research studies, which were conducted in past years and dealt with vibration stress issues. Shows individual factors, which has effect on vibration response of DPS and its destruction, like component position, acceleration difference between component and substrate, around temperature or material constants. In practical part was chosen method of vibration test and experiment in Labview programming interface was performed to verify these findings from vibration theory.
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Elimination of defects in Si substrates by Rapid Thermal Process application
Frantík, Ondřej ; Hégr, Ondřej (referee) ; Szendiuch, Ivan (advisor)
Low cost, rapid and high thermal by IR heating, rapid cooling and high efficiency, there are RTP (Rapid Thermal Processing) properties. We can use RTP for annealing, diffusion, contacting, oxidation and others. Rapid temperature change and IR heating can be followed positive effects in the silicon substrate. This paper is focused on annealing by RTP. Wafers were p-type monocrystalline CZ silicon with different bulk minority carrier lifetime. Minority carrier lifetime was measured by MW-PCD (Microwave Photoconductance Decay) before and after thermal processing.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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Properties of Thick Film Multilayer Components
Shishkin, Alexey ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Purpose of our experiment to receive mathematical model for RC-RP elemets with different structure. As a objektive factor of mathematical model we will decide temperature coefficient of component's time constant. As a influence factors we'll choose production behaviour.To realize experimint for it. Number of factor's is three. After experiment to draw a conclusion about influence of poduction's error .
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Experimental Investigation of Integrated Thick Films
Čejka, Marek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This bachelor thesis deals with the theory of thick film technology. It describes implementation of thick layer integrated circuits, thick film technology, creen printing method. It includes basic electrical properties of thick layers. The aim of this work is the experimental work deals with the detection of current rating of conductors. The work includes the design of method of measuring and test structure.
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