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Monitoring the impact of ultrasonic energy to the leveling of thick film pastes
Pokluda, Tomáš ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This bachelor thesis is focused on the problem of levelling of a profile by ultrasound after printing thick layer pastes and on electrical resistance and geometrical dimensions changes. It describes a creation of hybrid integrated circuits, thick film technology and the screen printing method. It also includes basics of fluid physics, basics of fluid rheology, and description of principles of the used ultrasound transducer. Records of the levelling measurements are presented through the use of photographs, comments, tables and graphs.
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Basic thermal properties tester
Janečka, Marek ; Buršík, Martin (referee) ; Řezníček, Michal (advisor)
This work deals with metering heat feature of different types unyielding materials with the help of thermodynamic sensor. Here is above all surveyed, whether it is possible by the help of thermodynamic sensor mete heat conductivity and thermal resistance given to materials and subsequently accordingly to this to prove in part determine from measured results about what type of material walks.
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Monitoring of efficiency cleaning medium for printed circuit board
Jelínek, Tomáš ; Řezníček, Michal (referee) ; Buršík, Martin (advisor)
In this bachelor thesis various methods of cleaning and various types of cleaning agents commonly used in electrical engineering are described. In the experimental part cyclic voltammetry is used to measure the current–voltage characteristic of cleaning agent VIGON A 200. The new and the used cleaning agents are compared. Influence of measuring sensors is monitored. At the end of the bachelor thesis obtained data are evaluated and further processing steps for analysis are proposed.
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New Areas of the Ultrasonic Application in Microelectronics Technology
Buršík, Martin ; Pietriková, Alena (referee) ; Králová,, Iva (referee) ; Szendiuch, Ivan (advisor)
Doctoral thesis deals with the deposition of special thixotropic materials for microelectronic technology. The aim of the work is the development of the new method optimizing the dosing process in order to achieve a print resolution of better than 100 microns. The work includes the development of a special dispensing head (UZD) using the influence of ultrasonic energy. These results demonstrate the possibility of a newly developed method that is able to print thixotropic materials with a resolution of 65 microns. Compared to other methods achieves these results with the commonly used materials for thick film technology with particle size up to 5 microns.
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Automatization of 3D stacking process
Kamenec, Jan ; Řezníček, Michal (referee) ; Buršík, Martin (advisor)
The task of my thesis was to automate the process of 3D stacking. The work includes design of complex control board, that will serve as a control unit and provide a comprehensive function of mechanical displacement in combination with digital image acquisition. In addition, the electronics for controlling a stepper motor, PCB and the design. The result of this is a facility that provides automatic acquisition of images with different depth of field.
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Optimalization of ultrasonic interconnection
Gregor, Pavel ; Hejátková, Edita (referee) ; Buršík, Martin (advisor)
The thesis summarizes the basic knowledge of Wirebonding. It also closely studying the various influences on the final shape, strength and reliability of the bonds. In the experimental part are found the optimal settings of various wire bonders. For wire bonder TPT HB-10 are found the optimal settings for different types of surfaces, which were contacted.
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The direct writing of thick film pastes
Ištvánek, Jan ; Řezníček, Michal (referee) ; Buršík, Martin (advisor)
This work deals with the problem of the thick-film pastes and their printing. In the main chapter of this work, the realization of a workplace for thick-film pastes' printing is described. The construction of the realized plotter and the controlling electronics of the plotter is depicted in detail.In the following chapter, the console, through which the plotter is controlled via PC, and the CAD program, which serves for projecting of the motives printed, are described.In the final chapter of this work, the measured profiles of the paste printed for various settings of printing parameters and the photographs of the motives printed are stated.
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