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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
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Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
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Creep-fatigue models for solder joints reliability prediction
Novotný, Václav ; Šandera, Josef (referee) ; Švecová, Olga (advisor)
This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage for estimate of reliability solder joint, advantages and disadvantages. There are discusssed properties of single models, which are on different base. Purpose of this project is find optimal creep-fatigue model for lead-free solder and devise a test structure to which the model will be verified. Results are compared with theoretical calculations.
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The influence of a pre-print thick layer paste viscosity on forming of layer
Ondráček, Michal ; Švecová, Olga (referee) ; Klíma, Martin (advisor)
This bachelor thesis deals with the theory of thick film technology and applying these layers. The work also includes basics of liquid rheology, methods of measurement viscosity and ways of mixing liquids. The main aim is to determine the influence of viscosity of thick film pastes for printing quality of the test structure using screen printing, in particular its flatness and sharpness. The aim is also measure the dependence of viscosity thick film pastes on mixing time.
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Properties of metal layers realized with vapour deposition
Milichovský, Miloš ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This work deals with vacuum evaporation of metals, basic principles of this technology and exploring the properties of the resulting layer. It describes how vacuum evaporation works and its individual parts.The main part deals with evaporation of copper and other substances and the conductivity of the resulting film in relation to its thickness. As a parameter for measuring substrate temperature is specified.
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Creep-fatigue models for solder joints reliability prediction
Novotný, Václav ; Šandera, Josef (referee) ; Švecová, Olga (advisor)
This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage for estimate of reliability solder joint, advantages and disadvantages. There are discusssed properties of single models, which are on different base. Purpose of this project is find optimal creep-fatigue model for lead-free solder and devise a test structure to which the model will be verified. Results are compared with theoretical calculations.
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Parameters of BGA-type interconnection joints ceramic Al2O3 substrates
Somer, Jakub ; Švecová, Olga (referee) ; Nicák, Michal (advisor)
This project deals with questions related to parameters of solder balls, used on BGA packages, on ceramic substrates. First part of this project contains general characteristic of solder balls, their properties and usage. In the following part there are described technologies and methods used during the experiment including the design of test substrate. The last part is dedicated to practical examination of compatibility of selected conductive pastes, solder pastes and fluxes during vapor reflow soldering. At the end of this work the selection of materials, assembly, soldering and microsections are described.
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