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Creep-fatigue models for solder joints reliability prediction
Novotný, Václav ; Šandera, Josef (referee) ; Švecová, Olga (advisor)
This project is focused on utilization of creep-fatigue models for estimate of reliability lead-free solder joints. It describes basic groups of creep-fatigue models, their usage for estimate of reliability solder joint, advantages and disadvantages. There are discusssed properties of single models, which are on different base. Purpose of this project is find optimal creep-fatigue model for lead-free solder and devise a test structure to which the model will be verified. Results are compared with theoretical calculations.
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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
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Reliability of Lead-free Solders and the Selected Methods to Estimate its Lifetime
Švecová, Olga ; Kolařík, Vladimír (referee) ; Urbánek,, Jan (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on reliability of lead-free solder SAC 305. Knowledge in the field of fatigue models used in determining the lifetime of solder joints are observed in this thesis. Also such methods of predicting reliability as numerically-analytical methods or reliability experimental tests are mentioned. Practical results of reliability measurement are presented. Experimental data served as the foundation for determining empirical coefficients for the fatigue model based on deformation induced by creep of the solder, which was implemented in the ANSYS environment. Results from different methods were compared and conclusions discussing the suitability of the presented prediction methods are formulated.
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Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
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Characteristic measuremens of thick-film RC elements with distributed parameters
Kořínková, Ksenia ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The following work is focused on properties analysis of thick film RC elements with distributed parameters. The theoretical part offers projecting of RC elements, with their next realization. There are the following work parts: the resistance measurement and determination of the given resistances dependence scattering with different film number of the structures depending on their burning conditions. This bachelor's thesis is closed to the bachelor's work "Properties of Thick Film Multilayer Component".
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Properties of Thick Film Multilayer Components
Shishkin, Alexey ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Purpose of our experiment to receive mathematical model for RC-RP elemets with different structure. As a objektive factor of mathematical model we will decide temperature coefficient of component's time constant. As a influence factors we'll choose production behaviour.To realize experimint for it. Number of factor's is three. After experiment to draw a conclusion about influence of poduction's error .
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Analysis of electrical properties of cardiac cells
Švecová, Olga ; Čmiel, Vratislav (referee) ; Šimurda, Jiří (advisor)
The diploma thesis is focused on the analysis of the electrical properties of the heart cells membranes. The main goal of this work is to answer to what extent it is possible to infer from experimental data on the detailed mechanism of interaction of substances with channels. The work also presents a detailed description of methods of measurement of membrane voltage and current, which are used in the experimental measurements. There are also discussed the individual channels of the cell membrane and ion currents, which arise as a response to the rectangular pulse voltage. There is also described the effect of various substances on the properties of ion currents flowing through the cell membrane.
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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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