Original title: Studie struktury tuhnutí pájeného spoje SMD rezistoru při průchodu elektrickým proudem
Translated title: Study of the solidification structure of a solder joint of an SMD resistor during passing an electric current
Authors: Voda, Erik ; Otáhal, Alexandr (referee) ; Skácel, Josef (advisor)
Document type: Bachelor's theses
Year: 2024
Language: slo
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [slo] [eng]

Keywords: electromigration; intermetallic compounds; Metallography; SAC 305; solder alloys; solder-joint microstructure; soldering; thermal migration

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: https://hdl.handle.net/11012/247436

Permalink: http://www.nusl.cz/ntk/nusl-619223


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2024-06-22, last modified 2024-06-22


No fulltext
  • Export as DC, NUŠL, RIS
  • Share