Original title: Měření teplotních profilů BGA pouzder u pájení přetavením
Translated title: Temperature Profiles Measurement of BGA Packages in Reflow Soldering
Authors: Tomčáková, Anna ; Bureš, Tomáš (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2008
Language: slo
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [slo] [eng]

Keywords: PBGA; PCB; profile optimization; reflow soldering; thermal profile; thermocouples - measurement with thermocouples

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/15063

Permalink: http://www.nusl.cz/ntk/nusl-605913


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2024-04-02, last modified 2024-04-03


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