Original title: Návrh a optimalizace procesu pájení skelných pájek
Translated title: Design and optimization of soldering process of solder glasses
Authors: Vinklerová, Viktorie ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
Document type: Bachelor's theses
Year: 2022
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: ceramic casing; coeficient of thermal expansion; sealing; solder glass; soldering process; keramické pouzdro; koeficient teplotní roztažnosti; pájecí proces; skelná pájka; těsnění

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/205687

Permalink: http://www.nusl.cz/ntk/nusl-602582


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2024-04-02, last modified 2024-04-03


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