Original title: Termomechanické namáhání bezolovnatého pájeného spoje
Translated title: Thermomechanical Stress of Lead Free Solder Joint
Authors: Libich, Jiří ; Šandera, Josef (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2011
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: finishing; Lead-free solder joint; reliability; shear test; strength.; Bezolovnatý pájený spoj; pevnost.; povrchová úprava; spolehlivost; test střihem

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/1773

Permalink: http://www.nusl.cz/ntk/nusl-590507


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2024-04-02, last modified 2024-04-03


No fulltext
  • Export as DC, NUŠL, RIS
  • Share