Original title: Bezolovnatý pájený spoj a modely predikce spolehlivosti
Translated title: Lead Free Solder Joint - Models for Reliability Prediction
Authors: Nestrojil, Michal ; Šandera, Josef (referee) ; Starý, Jiří (advisor)
Document type: Bachelor's theses
Year: 2012
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: deformation; fatigue; Lead-free solder joint; reliability; resistivity; strength; Bezolovnatý pájený spoj; deformace; pevnost; rezistivita; spolehlivost; únava

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/12041

Permalink: http://www.nusl.cz/ntk/nusl-549959


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2024-04-02, last modified 2024-04-03


No fulltext
  • Export as DC, NUŠL, RIS
  • Share