Original title: Odvrstvování polovodičových čipů
Translated title: Delayering of semiconductor chips
Authors: Valachovič, Marek ; Adámek, Martin (referee) ; Búran, Martin (advisor)
Document type: Master’s theses
Year: 2023
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: chemical etching; decapsulation; delayering of semiconductor chip; EDX.; FIB; Layers of semiconductor chip; packages; parallel polishing; RIE; chemické leptání; dekapsulace; EDX.; FIB; odvrstvování polovodičového čipu; parallel polishing; pouzdra; RIE; Vrstvy polovodičového čipu

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/210024

Permalink: http://www.nusl.cz/ntk/nusl-526529


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2023-06-18, last modified 2023-06-18


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