Original title: Investigation Of Influence Nitrogen Atmosphere On The Spreadability And Reliability Of Solder Joints
Authors: Vala, Martin
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This article examines the impact of nitrogen atmosphere on the quality of the solder joint. For tests were used two lead-free solder pastes, specifically SAC305 and SN100C. These pastes were printed on a substrate FR4 with ENIG finish with semiautomatic devices. For reflow of paste was used specially modified desiccator. This device has hot plate with the cooling system. This system is active after reflow. In this device, it was possible to create around the solder paste a nitrogen atmosphere having defined content of residual oxygen. This experiment determined the most appropriate concentration of the protective gas atmosphere to obtain the greatest wettability and spreadability of paste, which is a prerequisite for a good solder joint.
Keywords: lead – free; modified atmosphere; nitrogen; quality of the solder joint; Solder reflow; temperature profile
Host item entry: Proceedings of the 23st Conference STUDENT EEICT 2017, ISBN 978-80-214-5496-5

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/187163

Permalink: http://www.nusl.cz/ntk/nusl-414823


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers