Original title: The Technology Of Ceramic Packages
Authors: Skácel, Josef
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.
Keywords: ceramic; packaging; simulation; sintering
Host item entry: Proceedings of the 23st Conference STUDENT EEICT 2017, ISBN 978-80-214-5496-5

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/187162

Permalink: http://www.nusl.cz/ntk/nusl-414822


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers