Original title: Usage Of Solders With Higher Melting Point For Hybrid Integrated Circuits
Authors: Janda, Ondřej
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This article deals with the advantages of brazing that uses an experimental tool for heat conduction, which can be used in thick film technology. In present days brazing on thick film is used in a few applications in microelectronic industry. At higher soldering temperatures there is also an increase in demands leading to creation of high quality joints. The joints made by brazing are mainly used for special applications for power electronics, heating elements and temperature or other sensors.
Keywords: Brazing; leaching; thick film
Host item entry: Proceedings of the 24th Conference STUDENT EEICT 2018, ISBN 978-80-214-5614-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/138174

Permalink: http://www.nusl.cz/ntk/nusl-393360


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