Original title:
Modifikace metody smáčecích vah pro měření smáčivosti SMD
Translated title:
Wetting Balance Method Modification for SMD Wettability Measuring
Authors:
Drab, Tomáš ; Kahle, Petr (referee) ; Starý, Jiří (advisor) Document type: Bachelor's theses
Year:
2009
Language:
slo Publisher:
Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií Abstract:
[slo][eng]
Práca prezentuje hlavné vplyvy na zmáčavosť SMD a DPS spájkou SAC 305 a možnosti jej testovania. Vypracovali sme návrh na modifikáciu metódy zmáčacích váh na gužôčkovú metódu. Testovali sme rozdiely v teplotnom profile a určili kompenzáciu teplotného rozdielu. Testovali sme rôzne typy zakončení SMD púzdier a povrchových úprav DPS, pri použití dvoch rôznych spájok a dvoch tavív. Sledovali sme vežkosti zmáčacích síl, zmáčaciu rýchlosť a stabilitu síl. Naznačili sme ďalšie možnosti pre optimalizáciu metódy a testovanie.
Project presents main influence on wettability of SMD and PCB using solder SAC 305 and testing possibilities. We have designed modificaton of wettability balance method leading to the solder globule method. We were testing thermal profile difference and then we determined thermal difference compensation. We were testing few types of SMD packages terminations and PCB´s surface protections, with two solders and two fluxes. We were comparing their wetting forces, wetting speed, and wetting stability. We have proposed other possibilities to optimisation of the method and testing.
Keywords:
meniscograph; PCB; SMD; solder globule method; solder solderability; wetting; wetting balance method; wetting forces
Institution: Brno University of Technology
(web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library. Original record: http://hdl.handle.net/11012/2828