Original title: Anodické pájení sendvičových struktur
Translated title: Anodic bonding of sandwich structures
Authors: Urbánek, Petr ; Kosina, Petr (referee) ; Pekárek, Jan (advisor)
Document type: Master’s theses
Year: 2013
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: Anodic bonding; Glass.; MEMS; Silicon; Temperature; Voltage; Anodické pájení; Křemík; MEMS; Napětí; Sklo.; Teplota

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/26973

Permalink: http://www.nusl.cz/ntk/nusl-220223


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2016-06-03, last modified 2022-09-04


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