Original title: Analysis and Prediction of Reliability of Solder Joints
Authors: Novotný, V.
Document type: Papers
Language: eng
Publisher: Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Abstract: This article deals with the sphere of solder joints reliability and narrower focus is using simulation software ANSYS and fatigue models for estimate reliabity of solder joints. The text describes the introduction to the issue of the reliability of soldered connections and important factors with their influences. Then are described some options for prediction of reliability. This includes the issue of fatigue models and design of simulation in simulating software ANSYS. In conclusion, there are described output of simulations and options for calculation by fatigue models.
Keywords: ANSYS; EEICT; fatigue models; Reliability; Simulation; Solder joints
Host item entry: Proceedings of the 21st Conference STUDENT EEICT 2015, ISBN 978-80-214-5148-3

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/43028

Permalink: http://www.nusl.cz/ntk/nusl-207219


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Universities and colleges > Public universities > Brno University of Technology
Conference materials > Papers