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Optimization of deep reactive ion etching process
Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
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Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
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Design of aparature for RF plasma etching
Bárdy, Stanislav ; Bábor, Petr (referee) ; Mach, Jindřich (advisor)
This bachelor's thesis deals with a design of an ICP (Inductively Coupled Plasma) apparatus. The theoretical part consists of a research of a plasmatic graphene surface cleaning. Next are described plasma generation methods and an RF circuit design. The experimental part deals with a construction of the ICP apparatus and the impedance matching box, an optical diagnostics of a plasma discharge and a measurement of PMMA etching parameters (etch rate, roughness) by a spectroscopic reflectometry and an atomic force microscopy.
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Fabrication and testing of MEMS device components for micromanipulation
Binková, Petra ; Prášek, Jan (referee) ; Liška, Jiří (advisor)
This diploma thesis deals with the production and testing of MEMS devices intended for micromanipulations with a possibility of their usage in a scanning electron microscope, which includes manipulation of microobjects such as metal microparticles, microfibres or even biological samples. The first chapter contains a detailed study of microsystems and MEMS devices. The next chapter describes various types of micromanipulations, including MEMS. The third chapter deals with possible techniques of microfabrication. The fourth chapter contains experimental part of this work, in which two versions of silicon microgrippers were proposed. Considering available solutions of micromanipulators, principal and spatial limitations in the electron microscope, the piezoelectric actuator was chosen as the gripping principle. Direct write laser lithography and deep reactive ion etching were used to produce the microgrippers, and it was necessary to optimize these techniques for selected application. During the optimizations, various problems were solved, including the elimination of black silicon formation, unsuccessful etching of narrow deep structures, etc. Prototype of one of the proposed microgripper was successfully created. The manufactured micromanipulators were subsequently tested under an optical microscope. During testing, it was necessary to modify the position of the actuator in the device to ensure that the jaws of the manipulator are clamped.
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Optimization of deep reactive ion etching process
Houška, David ; Hrdý, Radim (referee) ; Prášek, Jan (advisor)
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE) processes. The thesis describes characterization of silicon etching methods, the principle of DRIE and the influence of individual parameters on the resulting etch profile. Based on the analysis of fabricated samples using scanning electron microscopy (SEM), both processes were optimized to create narrow microstructures with diameters ranging from 1 to 16 µm with the highest achieved depth-to-width ratio of 28:1 on a silicon substrate. Furthermore, surface roughness was analyzed using atomic force microscopy (AFM) and the presence of fluorine residues by X-ray photoelectron spectroscopy (XPS) in structures etched by both processes.
|
|
|
Fabrication of micro- and nanostructures by different etching methods
Těšík, Jan ; Urbánek, Michal (referee) ; Šamořil, Tomáš (advisor)
The selective etching is currently very widely used method for the preparation of micro- and nanostructures. This thesis deals with the principles of the etching methods, their applications and also the possibilities of dry and wet etching at the Institute of Physical Engineering. The experimental part is devoted to the preparation of the etching masks to ensure etching selectivity and to the preparation of pre-defined micro- and nanostructures. Important parameters were determined from the results, e.g. Si etch rate, selectivity of the masks etc. Further, the suitability of the used methods and etching masks were compared.
|
|
|
Design of aparature for RF plasma etching
Bárdy, Stanislav ; Bábor, Petr (referee) ; Mach, Jindřich (advisor)
This bachelor's thesis deals with a design of an ICP (Inductively Coupled Plasma) apparatus. The theoretical part consists of a research of a plasmatic graphene surface cleaning. Next are described plasma generation methods and an RF circuit design. The experimental part deals with a construction of the ICP apparatus and the impedance matching box, an optical diagnostics of a plasma discharge and a measurement of PMMA etching parameters (etch rate, roughness) by a spectroscopic reflectometry and an atomic force microscopy.
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