Original title: Nízkoteplotní bizmutové pájecí pasty
Translated title: Bismuth Low Temperature Solder Pastes
Authors: Švéda, Miloš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
Document type: Master’s theses
Year: 2019
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: BiSn; microsection; PCB; reflow soldering; SMD; test method; BiSn; DPS; mikrovýbrus; pájení přetavením; SMD; testovací metody

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/177805

Permalink: http://www.nusl.cz/ntk/nusl-399588


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Master’s theses
 Record created 2019-08-26, last modified 2022-09-04


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