Original title: Near threshold fatigue crack growth in ultrafine-grained copper
Authors: Arzaghi, M. ; Fintová, S. ; Sarrazin-Baudoux, C. ; Kunz, Ludvík ; Petit, J.
Document type: Papers
Conference/Event: NanoSPD6 - International Conference on Nanomaterials by Severe Plastic Deformation /6./, Metz (FR), 20140630
Year: 2014
Language: eng
Abstract: The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at Delta K <= 7 MPa root m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude Delta K-eff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.
Keywords: ALLOYS; BEHAVIOR; METALS; SEVERE PLASTIC-DEFORMATION
Project no.: GAP108/10/2001 (CEP)
Funding provider: GA ČR
Host item entry: 6TH INTERNATIONAL CONFERENCE ON NANOMATERIALS BY SEVERE PLASTIC DEFORMATION (NANOSPD6), ISSN 1757-8981

Institution: Institute of Physics of Materials AS ČR (web)
Document availability information: Fulltext is available at the institute of the Academy of Sciences.
Original record: http://hdl.handle.net/11104/0279814

Permalink: http://www.nusl.cz/ntk/nusl-373425


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