Original title: Prokovy v nízkoteplotní keramice
Translated title: The via interconnection in LTCC
Authors: Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
Document type: Bachelor's theses
Year: 2013
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: 3D structure; HeraLock 2000; LTCC; via diameter; via interconnection; 3D štruktúra; HeraLock 2000; LTCC; priemer prokovu; prokov

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/24780

Permalink: http://www.nusl.cz/ntk/nusl-243677


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2016-06-03, last modified 2019-08-26


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