Original title: Modelování termo-mechanického namáhání v bezolovnatých pájených spojích po zrychleném stárnutí
Translated title: Modelling of thermo-mechanical stress in lead-free solder joints after thermal aging
Authors: Maslák, Marián ; Novotný, Marek (referee) ; Vaško, Cyril (advisor)
Document type: Bachelor's theses
Year: 2009
Language: slo
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [slo] [eng]

Keywords: ANSYS; modelling; shear stress; solder joint; thermal aging

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/15077

Permalink: http://www.nusl.cz/ntk/nusl-227371


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2016-06-03, last modified 2017-06-28


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