Original title: Kontaktování polovodičových čipů
Translated title: Semiconductor chip interconnection
Authors: Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
Document type: Bachelor's theses
Year: 2009
Language: cze
Publisher: Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií
Abstract: [cze] [eng]

Keywords: ANSYS; current density; thermomechanical stress; wirebonding; ANSYS; proudová hustota; termomechanické namáhání; wirebonding

Institution: Brno University of Technology (web)
Document availability information: Fulltext is available in the Brno University of Technology Digital Library.
Original record: http://hdl.handle.net/11012/8483

Permalink: http://www.nusl.cz/ntk/nusl-225207


The record appears in these collections:
Universities and colleges > Public universities > Brno University of Technology
Academic theses (ETDs) > Bachelor's theses
 Record created 2016-06-03, last modified 2019-03-28


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