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Bismuth Low Temperature Solder Pastes
Vogel, Vojtěch ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature soldering pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The effect of the elements on the eutectic solder alloy Sn-Bi58 is also described here. For the practical part two surface finishes (ENIG and immersion tin) and four solder pastes (PF743-PQ10, PF735-PQ10, PF734-PQ10, SAC305) are chosen. Tested PCBs are subjected to isothermal aging and cyclic temperature tests. Electrical resistance has changed during thermal aging.
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Design of anti-aliasing filter for discrete-time delta-sigma modulators
Vogel, Vojtěch ; Háze, Jiří (referee) ; Kledrowetz, Vilém (advisor)
This work deals with the design of a second order anti-aliasing filter with a cutoff frequency in the order of hundreds of kHz using the switched capacitor technique. The use of this technique allows the design of accurate and tunable analog circuits without the use of resistors. In this work, the design of analog switches is described. Furthermore, the various circuits required for the design of the filter in the onsemi I3T80 technology are proposed.
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Design of anti-aliasing filter for discrete-time delta-sigma modulators
Vogel, Vojtěch ; Háze, Jiří (referee) ; Kledrowetz, Vilém (advisor)
This work deals with the design of a second order anti-aliasing filter with a cutoff frequency in the order of hundreds of kHz using the switched capacitor technique. The use of this technique allows the design of accurate and tunable analog circuits without the use of resistors. In this work, the design of analog switches is described. Furthermore, the various circuits required for the design of the filter in the onsemi I3T80 technology are proposed.
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|
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Bismuth Low Temperature Solder Pastes
Vogel, Vojtěch ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This bachelor thesis deals with low-temperature soldering pastes with different bismuth content. It focuses on material, process and environmental influences that affect the reliability of the soldered joint. The effect of the elements on the eutectic solder alloy Sn-Bi58 is also described here. For the practical part two surface finishes (ENIG and immersion tin) and four solder pastes (PF743-PQ10, PF735-PQ10, PF734-PQ10, SAC305) are chosen. Tested PCBs are subjected to isothermal aging and cyclic temperature tests. Electrical resistance has changed during thermal aging.
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