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Testing of Solders in Protection Atmosphere
Vala, Radek ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The project deals with the overall design and construction of equipment called the desiccators for brazing in a protective atmosphere. The device was designed and manufactured cooling and heating element. For the soldering various temperature profiles have been defined and adjusted, as for SnPb as well for lead-free solders. There was a realization of samples were measured and analyzed. Finally were realized micro sections for lead free solder.
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Optimalization of CMOS Chip Interconnection Process for Higher Current Load
Novotný, Marek ; Mach,, Pavel (referee) ; Hulenyi,, Ladislav (referee) ; Szendiuch, Ivan (advisor)
This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.
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Ecological evaluation and labeling of electrical products
Kantorová, Aneta ; Šteffan, Pavel (referee) ; Szendiuch, Ivan (advisor)
This bachelor thesis is focused on the possibilities of reducing the negative effects of electrical products on the environment. After a general description of the current state, including activities aimed at awarding environmental labels, attention is focused on the possibilities of ecological evaluation of electrical products. Legislation according to the standards of the ISO 14020 series is applied for this that are focused on three possibilities of awarding eco-labels. In the practical part a procedure for awarding the ECO mark according to the ISO 14021 standard is proposed. This could be granted by the manufacturers themselves on compliance with the prescribed conditions as in the case of the declaration of conformity for the CE marking.
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Investigation of Reliability for Solder Joints
Toufar, Michal ; Somer, Jakub (referee) ; Szendiuch, Ivan (advisor)
It evaluates the importance of soldering in a protective atmosphere. Factors influencing the process of reflow soldering in a protective atmosphere of nitrogen. Evaluates the quality of solder joints due to a defined residual oxygen during the soldering proces. According finishes used on the resulting quality connections for two types of lead free solder.
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Machanical testing of solder joints
Drab, Tomáš ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
The project contains theoretical research of electrotechnical manufacture for lead-free reflow soldering. It contains characterization of soldering processes. Includes variations of solder paste printing, principles of part placing and also reflow soldering process. The project appoints possibilities of testing solder joints strength, mainly focused on mechanical vibrations. It describes a design and preparation of solder joint strength test methods by mechanical vibrations. It compares influence of vibrations on part types and solder alloys.
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Design and realisation of solder-ball mounting device
Bobek, Josef ; Szendiuch, Ivan (referee) ; Nicák, Michal (advisor)
This work deals with issues of design and construction of facilities for mounting solder balls. The first part includes a familiarization with the types, manufacture and assembly of solder balls in practice. The following section includes the actual construction work on the equipment, procedures, considerations and finish work on the plant. The last part provides information about solder balls testing, which are mounted on the FRITSCH station, and compares potential errors.
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Research of the Quality of Solder Joints by BGA and QFN Packages
Otáhal, Alexandr ; Adámek, Martin (referee) ; Szendiuch, Ivan (advisor)
This diplomas thesis deals with specific technologies and manufacture of BGA and QFN packages. Also summarizes the most used test methods for assessing the reliability for. Describes the making of equipment for soldering in a nitrogen atmosphere, followed by comparison solder joints of BGA and QFN forming in different atmosphere. Finally, summarizes knowledge about the process of soldering and desoldering lead-free solders for BGA packages, followed by experimental evaluation of the causes of malfunction of repaired samples.
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New ways in Packaging
Hřešil, Tomáš ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
This project deals with the creating a base of manual for modern electronic packages, which are more and more used in today's electronic circuits and devices. The modern packages are mentioned small outline DIL, QFP, BGA, PGA, CSP, Flip chip. The work is also including packages known SiP (System in Package) that are consisting or use the combinations of packages BGA, PGA, CSP and Flip Chip. At the end of the work are short described the most important design rules for assembly of mentioned packages on substrate (PCB).
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