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Thermal Contact Resistance Under High Temperature
Kvapil, Jiří ; Návrat, Tomáš (referee) ; Brestovič, Tomáš (referee) ; Horský, Jaroslav (advisor)
Nowadays numerical simulations are used to optimize manufacturing process. These numerical simulations need a large amount of input parameters and some of these parameters have not been sufficiently described. One of this parameter is thermal contact resistance, which is not sufficiently described for high temperatures and high contact pressure. This work describes experimental measuring of thermal contact resistance and how to determine thermal contact conductance which can be used as a boundary condition for numerical simulations. An Experimental device was built in Heat Transfer and Fluid Flow Laboratory, part of Brno University of Technology, and can be used for measuring thermal contact conductance in various conditions, such as contact pressure, initial temperatures of bodies in contact, type of material, surface roughness, presence of scales on the contact surface. Bodies in contact are marked as a sensor and a sample, both are embedded with thermocouples. The temperature history of bodies during an experiment is measured by thermocouples and then used to estimate time dependent values of thermal contact conductance by an inverse heat conduction calculation. Results are summarized and the dependence of thermal contact conductance in various conditions is described.
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Development of Inverse Tasks Solved by Using the Optimizing Procedures and Large Number of Parallel Threads
Ondroušková, Jana ; Skarolek, Antonín (referee) ; Brestovič, Tomáš (referee) ; Horský, Jaroslav (advisor)
In metallurgy it is important to know a cooling efficiency of a product as well as cooling efficiency of working rolls to maximize the quality of the product and to achieve the long life of working rolls. It is possible to examine this cooling efficiency by heat transfer coefficients and surface temperatures. The surface temperature is hardly measured during the cooling. It is better to compute it together with heat transfer coefficient by inverse heat conduction problem. The computation is not easy and it uses estimated values which are verified by direct heat conduction problem. The time-consuming of this task can be several days or weeks, depends on the complexity of the model. Thus there are tendencies to shorten the computational time. This doctoral thesis considers the possible way of the computing time shortening of inverse heat conduction problem, which is the parallelization of this task and its transfer to a graphic card. It has greater computing power than the central processing unit (CPU). One computer can have more compute devices. That is why the computing time on different types of devices is compared in this thesis. Next this thesis deals with obtaining of surface temperatures for the computation by infrared line scanner and using of inverse heat conduction problem for the computing of the surface temperature and heat transfer coefficient during passing of a test sample under cooling section and cooling by high pressure nozzles.
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Thermal Contact Resistance Under High Temperature
Kvapil, Jiří ; Návrat, Tomáš (referee) ; Brestovič, Tomáš (referee) ; Horský, Jaroslav (advisor)
Nowadays numerical simulations are used to optimize manufacturing process. These numerical simulations need a large amount of input parameters and some of these parameters have not been sufficiently described. One of this parameter is thermal contact resistance, which is not sufficiently described for high temperatures and high contact pressure. This work describes experimental measuring of thermal contact resistance and how to determine thermal contact conductance which can be used as a boundary condition for numerical simulations. An Experimental device was built in Heat Transfer and Fluid Flow Laboratory, part of Brno University of Technology, and can be used for measuring thermal contact conductance in various conditions, such as contact pressure, initial temperatures of bodies in contact, type of material, surface roughness, presence of scales on the contact surface. Bodies in contact are marked as a sensor and a sample, both are embedded with thermocouples. The temperature history of bodies during an experiment is measured by thermocouples and then used to estimate time dependent values of thermal contact conductance by an inverse heat conduction calculation. Results are summarized and the dependence of thermal contact conductance in various conditions is described.
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Development of Inverse Tasks Solved by Using the Optimizing Procedures and Large Number of Parallel Threads
Ondroušková, Jana ; Skarolek, Antonín (referee) ; Brestovič, Tomáš (referee) ; Horský, Jaroslav (advisor)
In metallurgy it is important to know a cooling efficiency of a product as well as cooling efficiency of working rolls to maximize the quality of the product and to achieve the long life of working rolls. It is possible to examine this cooling efficiency by heat transfer coefficients and surface temperatures. The surface temperature is hardly measured during the cooling. It is better to compute it together with heat transfer coefficient by inverse heat conduction problem. The computation is not easy and it uses estimated values which are verified by direct heat conduction problem. The time-consuming of this task can be several days or weeks, depends on the complexity of the model. Thus there are tendencies to shorten the computational time. This doctoral thesis considers the possible way of the computing time shortening of inverse heat conduction problem, which is the parallelization of this task and its transfer to a graphic card. It has greater computing power than the central processing unit (CPU). One computer can have more compute devices. That is why the computing time on different types of devices is compared in this thesis. Next this thesis deals with obtaining of surface temperatures for the computation by infrared line scanner and using of inverse heat conduction problem for the computing of the surface temperature and heat transfer coefficient during passing of a test sample under cooling section and cooling by high pressure nozzles.
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