National Repository of Grey Literature 32 records found  1 - 10nextend  jump to record: Search took 0.00 seconds. 
Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
Hot dip galvanizing of the steel construction
Pometlo, Stanislav ; Vyplašil, Evžen (referee) ; Kubíček, Jaroslav (advisor)
This master´s thesis deals with hot dip galvanizing of steel constructions and their protection from corrosion. This work describes the origin of corrosion of steel and its corrosion in different areas and presents degreasing and pickling before hot dip galvanization. It describes possibilities of making zinc layer by the wet and draw method of hot dip galvanization. Furthermore, it puts forward reactions between zinc and iron, possible defects of the zinc layer and influence of the hot dip galvanizing on the steel constructions. The experimental part examines the influence of the hydrogen charging on the material and the time of the flux operation on the quality of layer. The work further analyses the changing of mechanical properties of steels Hardox 500 and Weldox 700 as a result of the hydrogen embrittlement during pickling by the hydrochloric acid.
Wave Soldering Fluxes Comparison
Stoklásek, Lukáš ; Martinec, Petr (referee) ; Starý, Jiří (advisor)
Semestral thesis introduces the problematics of wave soldering fluxes, flux residues and problems of electromigration. Practical part describes measuring of ionic contamination by using conductometric method, measuring the wettability by the wetting balance method and amount of failures on wave soldered printed circuit boards with these fluxes. The main object is to compare quality of the fluxes.
Wetting Balance Method - Evaluation of PCB Material and Process Factors
Chloupek, Tomáš ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with issues of the wetting forces during soldering and evaluates material and procedural effects on the soldering process. The aim is to set the technology operations to get best quality of soldered joints.
Influence of fluxes on weld metal properties
Holub, Kamil ; Sigmund, Marian (referee) ; Kubíček, Jaroslav (advisor)
This thesis deals with the topic of submerged arc welding – an electric arc method of fusion welding, that uses a layer of granulated flux to shield the weld pool from atmospheric gases. Theoretical part is devoted to the description of the welding method and fluxes currently used. The practical part contains an experiment, which consists of making two weld deposits on structural steel S235JR by using different fluxes. First weld deposit is made with OK 10.62 Flux. The same flux alloyed with the Tribaloy T-800 laser cladding powder is used for the second weld deposit. Test specimens are examined on the basis of influence of fluxes combined with a single electrode wire.
Solder Joint Reliability and Wetting Characteristics Influence
Labaj, Radek ; Stejskal, Petr (referee) ; Starý, Jiří (advisor)
This thesis deals with the methodology of testing the wetting characteristics for different material and process effects in the double-plated base material. Testing is performed by wetting balance method. There is designed procedure to calculate the angles on each side of the non-homogeneous material. The Design of Experiments method is used to interpret the results, by using this method are also interpreted electrical and mechanical properties of solder joints. The correlation with wetting characteristics is discussed.
Analysis of Aplication Flux and Solder Paste on PCB for BGA components
Toufar, Michal ; Řihák, Pavel (referee) ; Vala, Radek (advisor)
This thesis deals with rework of BGA components. There are described defects and errors in a solder joints. The current trend is focused on thin packages with fine pitch. It is assembled with smaller and smaller solder balls. It is described effect of different application of flux and solders paste for rework. The main part is focused on dipping and dispensing. These methods are suitable for repair process.
Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
Immersion Tin Surface Finish of PCB
Karzel, Vítězslav ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The aim of this work is to study and more deeply understand everything about surface finishing of the printed circuit boards, that are used for lead-free soldering. Mainly we should focus on immersion tin and prepare some fundamental information for future measurement. Therefore, in the first part of the thesis is our main task is to create a~sufficient theoretical background for printed circuit boards, immersion tin and solderability. Then we are able to use previously created theoretical background to measure selected samples. Thereafter the measured data can be used for more strict evaluation, from which the results of measurement can be obtained.
Flux Residues after Reflow Soldering
Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.

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