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Thin-film systems
Kuchařík, Jan ; Máca, Josef (referee) ; Zatloukal, Miroslav (advisor)
This bachelor thesis concerns to create of thin films on various types of substrates. In the theoretical parts is an overview of the formation of thin films using several techniques. The thesis contains an overview of substrate cleaning processes before the deposition of layer plates and tools for evaluating their properties. Finally, the masking method is discussed. In the experimental part, the acquaintance with the NP - 12 sputtering device and the production of samples took place. The adhesion of the produced samples was evaluated. Electrolysis of samples with titanium coated followed. Finally, the silicon substrate was masked.
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Optimization of production of thin films of metallic materials
Čejka, Marek ; Kadlec, Michal (referee) ; Šubarda, Jiří (advisor)
The present thesis deals with optimization of the formation of thin layers of metallic materials. In the theoretical part was elaborated overview of the implementation of the formation of thin- film structures, particularly using vacuum techniques. Chemical and physical vapor deposition. They were described methods of pretreatment of thin layers. The findings were discussed methods of controlling the pre-treated surface, quality control and mutual adhesion of coating layers. In the experimental part of the pre-treatment methods were selected and applied to selected substrates. Pretreatments were evaluated using a control surface by wetting angles and by atomic force microscopy. Then, the metal structure formed of copper on the pretreated substrates. Implementation by means of magnetron sputtering. Adhesion layers was checked by testing the surface lattice method. The quality was observed by scanning electron microscopy. The results were used to design the technological process of making metal layers.
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Polyethylenterepthalate Copper Plating for Conductive Structures Realisation
Chmela, Ondřej ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The content of this master’s thesis are methods of pretreatment and coating of the surface of PET to produce conductive copper structure and quality control. Thesis also includes theoretical analysis of these methods. Physical and chemical techniques of surface pretreatment methods are discussed in the theoretical part as well as methods making surface of substrate conductive, the subsequent galvanic copper plating and quality control of coating and testing of the adhesion between layers. The experimental part focuses on two methods of the polymer material surface pretreatments. The properties of these pretreatments were evaluated by using the atomic force microscopy and detection of surface energy by wetting and contact angle measurements. The surface is making conductive with cathode sputtering and electrochemical coating of copper. Adhesion of layers is tested mainly with scratch test and other methods. The results of these sub-operations are used for the realization of multi-layer conductive structures.
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Vacuum technologies for creating thin-film systems
Kuchařík, Jan ; Šafl, Pavel (referee) ; Zatloukal, Miroslav (advisor)
The theoretical part of this theses deals with the formation of thin films by vacuum methods. It is a chemical and physical deposition from the gas phase in vacuum environment. Chemical deposition takes place at elevated temperatures, which accelerate reactions. Physical deposition is most often only condensation of vapors of evaporated material. Physical methods are vacuum evaporation, as well as cathodic, ionic, reactive and magnetron sputtering. The formation of thin layers takes place according to 3 known mechanisms. Substrates must be surface treated before the deposition process. The quality of thin films is examined from several perspectives. The practical part is devoted to the production of a thin-film system of copper and tin on a glass substrate. These layers are separated by three different barrier metals. Subsequently, the prepared samples were exposed to thermal stress and were monitored by electron microscope. Diffusion processes at the thin film interface were compared.
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Vacuum technologies for creating thin-film systems
Kuchařík, Jan ; Šafl, Pavel (referee) ; Zatloukal, Miroslav (advisor)
The theoretical part of this theses deals with the formation of thin films by vacuum methods. It is a chemical and physical deposition from the gas phase in vacuum environment. Chemical deposition takes place at elevated temperatures, which accelerate reactions. Physical deposition is most often only condensation of vapors of evaporated material. Physical methods are vacuum evaporation, as well as cathodic, ionic, reactive and magnetron sputtering. The formation of thin layers takes place according to 3 known mechanisms. Substrates must be surface treated before the deposition process. The quality of thin films is examined from several perspectives. The practical part is devoted to the production of a thin-film system of copper and tin on a glass substrate. These layers are separated by three different barrier metals. Subsequently, the prepared samples were exposed to thermal stress and were monitored by electron microscope. Diffusion processes at the thin film interface were compared.
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Thin-film systems
Kuchařík, Jan ; Máca, Josef (referee) ; Zatloukal, Miroslav (advisor)
This bachelor thesis concerns to create of thin films on various types of substrates. In the theoretical parts is an overview of the formation of thin films using several techniques. The thesis contains an overview of substrate cleaning processes before the deposition of layer plates and tools for evaluating their properties. Finally, the masking method is discussed. In the experimental part, the acquaintance with the NP - 12 sputtering device and the production of samples took place. The adhesion of the produced samples was evaluated. Electrolysis of samples with titanium coated followed. Finally, the silicon substrate was masked.
|
|
|
Optimization of production of thin films of metallic materials
Čejka, Marek ; Kadlec, Michal (referee) ; Šubarda, Jiří (advisor)
The present thesis deals with optimization of the formation of thin layers of metallic materials. In the theoretical part was elaborated overview of the implementation of the formation of thin- film structures, particularly using vacuum techniques. Chemical and physical vapor deposition. They were described methods of pretreatment of thin layers. The findings were discussed methods of controlling the pre-treated surface, quality control and mutual adhesion of coating layers. In the experimental part of the pre-treatment methods were selected and applied to selected substrates. Pretreatments were evaluated using a control surface by wetting angles and by atomic force microscopy. Then, the metal structure formed of copper on the pretreated substrates. Implementation by means of magnetron sputtering. Adhesion layers was checked by testing the surface lattice method. The quality was observed by scanning electron microscopy. The results were used to design the technological process of making metal layers.
|
|
|
Polyethylenterepthalate Copper Plating for Conductive Structures Realisation
Chmela, Ondřej ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
The content of this master’s thesis are methods of pretreatment and coating of the surface of PET to produce conductive copper structure and quality control. Thesis also includes theoretical analysis of these methods. Physical and chemical techniques of surface pretreatment methods are discussed in the theoretical part as well as methods making surface of substrate conductive, the subsequent galvanic copper plating and quality control of coating and testing of the adhesion between layers. The experimental part focuses on two methods of the polymer material surface pretreatments. The properties of these pretreatments were evaluated by using the atomic force microscopy and detection of surface energy by wetting and contact angle measurements. The surface is making conductive with cathode sputtering and electrochemical coating of copper. Adhesion of layers is tested mainly with scratch test and other methods. The results of these sub-operations are used for the realization of multi-layer conductive structures.
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