|
| |
|
|
Wetting Balance Method Modification for SMD Wettability Measuring
Drab, Tomáš ; Kahle, Petr (referee) ; Starý, Jiří (advisor)
Project presents main influence on wettability of SMD and PCB using solder SAC 305 and testing possibilities. We have designed modificaton of wettability balance method leading to the solder globule method. We were testing thermal profile difference and then we determined thermal difference compensation. We were testing few types of SMD packages terminations and PCB´s surface protections, with two solders and two fluxes. We were comparing their wetting forces, wetting speed, and wetting stability. We have proposed other possibilities to optimisation of the method and testing.
|
|
|
Wetting Balance Method Modification for SMD Wettability Measuring
Drab, Tomáš ; Kahle, Petr (referee) ; Starý, Jiří (advisor)
Project presents main influence on wettability of SMD and PCB using solder SAC 305 and testing possibilities. We have designed modificaton of wettability balance method leading to the solder globule method. We were testing thermal profile difference and then we determined thermal difference compensation. We were testing few types of SMD packages terminations and PCB´s surface protections, with two solders and two fluxes. We were comparing their wetting forces, wetting speed, and wetting stability. We have proposed other possibilities to optimisation of the method and testing.
|
|
| |
guest ::
