|
|
Techniques of time-domain analysis of interconnects.
Lábsky, Balázs ; Petržela, Jiří (referee) ; Brančík, Lubomír (advisor)
This work deals with techniques of time-domain analysis of interconnects. After a studying crucial issue of time-domain analysis of interconnects methods of modeling and simulation simple interconnects in electrotechnics are described. For transient effect analysis two elementary methods can be used: the state variable method and the FDTD (Finite - Difference Time - Domain) method. The FDTD method can be used to solve partial differential equations in time domain, for instance equations of transmission lines. The method is very effective and delivers satisfactory results in case of linear and non-linear lines with a single “live” conductor. The method can be easily programmed in Matlab.
|
|
|
Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
|
|
|
Modern Assembly for Microelectronic and Electronic Modules
Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
|
|
|
Techniques of time-domain analysis of interconnects.
Lábsky, Balázs ; Petržela, Jiří (referee) ; Brančík, Lubomír (advisor)
This work deals with techniques of time-domain analysis of interconnects. After a studying crucial issue of time-domain analysis of interconnects methods of modeling and simulation simple interconnects in electrotechnics are described. For transient effect analysis two elementary methods can be used: the state variable method and the FDTD (Finite - Difference Time - Domain) method. The FDTD method can be used to solve partial differential equations in time domain, for instance equations of transmission lines. The method is very effective and delivers satisfactory results in case of linear and non-linear lines with a single “live” conductor. The method can be easily programmed in Matlab.
|
guest ::
