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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Modern Assembly for Microelectronic and Electronic Modules
 Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
Detailed record
Modern Assembly for Microelectronic and Electronic Modules
 Krajíček, Michal ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This thesis is considered about interconnect PCB with microelectronic and electronic modules. This thesis includes specification of basic organical and unorganical materials for substrates, definition of termomechanical strain, characterization present-day standards causes of assembly created by Autosplice company and other possible causes. Characterization the new causes of assembly with usage chip component. The practice part is interested in usage this new causes of assembly microelectronics modules for assembly module of intelligent controller.
Detailed record

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