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Heat transfer in modern automotive lights
Holec, Radek ; Klimeš, Lubomír (referee) ; Štětina, Josef (advisor)
The beginning of this thesis is dedicated to light in general and all different types of vehicle lightning, also deals with various types of light sources and specifically about LED where it describes the temperature change behaviour. Second part deals with heat transfer by conduction, convection, and radiation, it describes quantities and relationships needed for next capitols. In the penultimate part is described thermal management of headlights, therefore different options of cooling and causes of heat generation, and different types of PCBs that are used in automotive. In the last part is proposed the heatsink, which should be used for cooling LED chips of daytime running lights.
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Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
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Heat transfer in modern automotive lights
Holec, Radek ; Klimeš, Lubomír (referee) ; Štětina, Josef (advisor)
The beginning of this thesis is dedicated to light in general and all different types of vehicle lightning, also deals with various types of light sources and specifically about LED where it describes the temperature change behaviour. Second part deals with heat transfer by conduction, convection, and radiation, it describes quantities and relationships needed for next capitols. In the penultimate part is described thermal management of headlights, therefore different options of cooling and causes of heat generation, and different types of PCBs that are used in automotive. In the last part is proposed the heatsink, which should be used for cooling LED chips of daytime running lights.
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|
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Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
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