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Optimalization of CMOS Chip Interconnection Process for Higher Current Load
Novotný, Marek ; Mach,, Pavel (referee) ; Hulenyi,, Ladislav (referee) ; Szendiuch, Ivan (advisor)
This work deals with silicon chip interconnection with a view to high current up to 10A. A wire bonding method is used for interconnection. The first part of investigation is focused on the modeling and simulation by the help of program ANSYS. Thermo mechanical stressing and current density is important parts of this research. Stress and current density distribution are results of the first part. The experimental part describes transition resistance, electro migration and thermal process in the connection of wire and chip pad. A controlled current source (0 – 10A) is used for measurement. The current source makes it possible to 4-point method measurement with sampling rate 1,5MHz.
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Semiconductor chip interconnection
Mareš, Petr ; Vaško, Cyril (referee) ; Novotný, Marek (advisor)
The Bachelor Thesis deals with contacting semiconductor chips using wirebonding. Opening chapters devoted to technology interconnect chips with the enviroment and materials to use. Much of this work is devoted to simulation wirebonding connections in Ansys. The simulations are engaged in examining thermomechanical stress in wires and current density at contacts.Results carried out simulations are measured with a focus on reliability and stressability of individual wirebonding connections. Part of this work is also practical measurements current stressability of wirebonding connections. At the end of the work was examined how to change the current stressability wires after the application of glue on contact.
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DISCONNECTOR PARALLEL CURRENT PATHS OPTIMIZATION
Görig, Tomáš ; Tůma, Jan (referee) ; Dohnal, Petr (advisor)
The objective of this master´s thesis is diagnostic the actual disconnector current path that is unevenly stressed by nominal current. The most stressed parts are excessively heated. In next part are projected a few options to optimize the current path. The options are verified by simulation. The best option is recommended to the submitter.
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FEM analysis of overcurrent trip unit
Makki, Zbyněk ; Augusta, Zbyněk (referee) ; Valenta, Jiří (advisor)
The aim of the project was to prepare the given model of the current path in the environment of the SolidWorks programme, in order to simulate the flow path in the environment of the Ansys programme, where there was calculated the distribution of current density,voltage drops and heat loss on the the specified current track according to specified conditions. The obtained results are analyzed at the conclusion of this work.
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Magnetic field analysis with finite element method and magnetic sensor
Volf, Tomáš ; Kurfűrst, Jiří (referee) ; Skalka, Miroslav (advisor)
The magnetic field analysis by MKP and magnetic probe project deals with magnetic field analysis of asynchronous machine cross section. This analysis is written in detail along with the necessary theory of asynchronous machine and the ANSYS program. The magnetic field of selected machine is measured by magnetic probe and results are compared with calculation. The next part of thesis is draft of device for the magnetic field analysis.
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Simulation of circuit-breaker trip unit
Dostál, Lukáš ; Augusta, Zbyněk (referee) ; Valenta, Jiří (advisor)
Securing of electrical devices is important not only to protect against destruction under the effects of electric current, but also for protection of people or animals against electric shock. With increasing of living standards goes hand in hand increasing of the electricity consumption. Therefore In the grid of low voltage, there are increasing short-circuit currents. With improving technology is posed considerable demand on the performance, security and switching capacity of circuit breakers. This thesis is oriented on development of thermal and electromagnetic switch of circuit breaker on which is put a big demand in development of new types of circuit breakers. The thesis is interesting because of comprehensive use of circuits’ breakers since it can be used in AC and DC networks with frequency of 50 Hz and 400 Hz.
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Measurement of current density distribution in shaped e-beam writers
Horáček, Miroslav ; Bok, Jan ; Kolařík, Vladimír ; Urbánek, Michal ; Matějka, Milan ; Krátký, Stanislav
The ZrO W(100) Schottky cathode is used in our e-beam writing system working with a rectangular-shaped electron beam. The homogeneous angular current density distribution is crucial for quality of exposures of the shaped beam lithography systems. Two basic types of the angular emission distribution can be observed in dependence on the microscopic final end form shape of the emitter tip, with bright centre and more common dark centre. The stable operation of the cathode thus stable end form shape requires a delicate balance of parameters inside the gun which however can slightly change during cathode life time. This implies the necessity of analysing and periodical monitoring the current density distribution in e-beam. Four methods enabling this measurement are presented.
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