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National Repository of Grey Literature 4 records found  Search took 0.00 seconds. 
Research of the influence of a new method for ball-attach process on BGA packages on intermetallic layers
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This work deals with exploring a new method of ball-attach process on BGA packages using a directly heated stencil. The existing procedures of making solder bumps were compared with possible benefits of using this new method. The methodology was established to create samples using a new reflow method and its effect on the formation and strength of intermetallic layers of solder bumps, due to the set height of the heated template, which was designed for reflow of BGA terminals. In addition to the design of the methodology, shear tests and metallographic sections of the samples were also performed. The thickness of the intermetallic layer and its roughness were examined. An evaluation of the results was performed on the basis of which a new method of reflow soldering of solder balls on BGA packages was optimized.
Detailed record
Research of reliability of solder ball terminals on BGA packages attached by innovative method
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This master´s thesis deals with the investigation of the reliability and service life of solder bumps on BGA packages created using new method using directly heated stencil. The methodology of reliability tests using isothermal and cyclic thermal aging of solder ball terminals was proposed. Test samples of BGA packages were created using this new method of reflow solder bumps and then was statistically evaluated. The internal structure and crystallographic orientation of the planes were investigated.
Detailed record
Research of reliability of solder ball terminals on BGA packages attached by innovative method
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This master´s thesis deals with the investigation of the reliability and service life of solder bumps on BGA packages created using new method using directly heated stencil. The methodology of reliability tests using isothermal and cyclic thermal aging of solder ball terminals was proposed. Test samples of BGA packages were created using this new method of reflow solder bumps and then was statistically evaluated. The internal structure and crystallographic orientation of the planes were investigated.
Detailed record
Research of the influence of a new method for ball-attach process on BGA packages on intermetallic layers
 Gregor, Adam ; Jankovský, Jaroslav (referee) ; Otáhal, Alexandr (advisor)
This work deals with exploring a new method of ball-attach process on BGA packages using a directly heated stencil. The existing procedures of making solder bumps were compared with possible benefits of using this new method. The methodology was established to create samples using a new reflow method and its effect on the formation and strength of intermetallic layers of solder bumps, due to the set height of the heated template, which was designed for reflow of BGA terminals. In addition to the design of the methodology, shear tests and metallographic sections of the samples were also performed. The thickness of the intermetallic layer and its roughness were examined. An evaluation of the results was performed on the basis of which a new method of reflow soldering of solder balls on BGA packages was optimized.
Detailed record

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