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Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
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Advancing Packiging and 3D systems
Nicák, Michal ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.
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Evolutionary Design of 3D Structures
Kovařík, Roman ; Sekanina, Lukáš (referee) ; Jaroš, Jiří (advisor)
This work deals with evolutionary design of 3D structures. The work brings the summary of the previous works in this area and brings autor's suggested solution of evolutionary design of 3D structures. This paper seeks to the ability of easy fitness function definition in the systems for evolutionary design of structures. The author tries to make one of the first steps to the future systems for evolution design of any universal structures in contrast with the evolution systems for design of a concrete type of structure. The result of this work is the basic system for evolutionary design of 3D structures with the ability of external fitness function definition via the XML file. This paper offers also the simple advices and observations for the potential future work in this area.
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Interconnection Technologies for 3D Electronic and Microelectronic Constructions
Nicák, Michal ; Pietriková,, Alena (referee) ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on research on application possibilities of soldered interconnection structures especially for the use with innovative 3D structures assembled using the LTCC ceramic materials, PVD deposited and galvanically modified pads, solid core solder balls. It consists of several main parts. Introduction is followed by theoretical survey of current situation and technologies. Thesis continues with introduction of main goals and with summary of successively performed experiments and their results. End of the work belongs to summary of results and gained knowledge.
|
|
|
Evolutionary Design of 3D Structures
Kovařík, Roman ; Sekanina, Lukáš (referee) ; Jaroš, Jiří (advisor)
This work deals with evolutionary design of 3D structures. The work brings the summary of the previous works in this area and brings autor's suggested solution of evolutionary design of 3D structures. This paper seeks to the ability of easy fitness function definition in the systems for evolutionary design of structures. The author tries to make one of the first steps to the future systems for evolution design of any universal structures in contrast with the evolution systems for design of a concrete type of structure. The result of this work is the basic system for evolutionary design of 3D structures with the ability of external fitness function definition via the XML file. This paper offers also the simple advices and observations for the potential future work in this area.
|
|
|
Advancing Packiging and 3D systems
Nicák, Michal ; Šandera, Josef (referee) ; Szendiuch, Ivan (advisor)
This project consists of three parts. The first part is aimed to summarize list of actual packaging systems and especially systems using 3D construction. Project continues in the second part, which is more practical and contains design and production of organic and inorganic testing substrates for lead-free soldered 3D structures. Last experimental part is about tests performed on soldered substrates and evaluation of results of these practical tests.
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