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National Repository of Grey Literature 4 records found  Search took 0.00 seconds. 
Development in 3D Packaging for Modern Electronics Systems
 Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
Detailed record
Application of Advanced Electronic Packaging Technology
 Zlámal, Jiří ; Kuchta, Radek (referee) ; Szendiuch, Ivan (advisor)
This bachelor's thesis sums up gained knowledge of current trends in packaging. First part focuses on various types of electrical packages and their functions while second part describes the process of designing an electrical package.
Detailed record
Application of Advanced Electronic Packaging Technology
 Zlámal, Jiří ; Kuchta, Radek (referee) ; Szendiuch, Ivan (advisor)
This bachelor's thesis sums up gained knowledge of current trends in packaging. First part focuses on various types of electrical packages and their functions while second part describes the process of designing an electrical package.
Detailed record
Development in 3D Packaging for Modern Electronics Systems
 Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
Detailed record

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