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The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
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The possibilities of SMD components soldering by equipment Fritsch
Juračka, Martin ; Šandera, Josef (referee) ; Adámek, Martin (advisor)
This thesis focuses on soldering technology in microelectronics. It describes in detail the basic ways of soldering and repairs in electronics. This piece of work shows the principles of technological equipment for bulk soldering and used repairing devices. In the theoretical part of this work there are also briefly described the packages for integrated circuits that were used in the practical part of the thesis. The practical part of the thesis deals with setting of the heat profiles for hot air repair station Fritsch Mikroplacer for LQFP64, SOIC16, TSSOP14, QFN16 and DSBGA5 packages. The heat profiles for assembly and disassembly of the particular types of the packages on designed and manufactured test printed circuit board were set and tested. The resulting heat profiles are compared with the recommended heat profile of an ordinary solder paste SnAg3Cu0,5 which was used for the test. This thesis can serve as an aid for the further settings of heat profiles in other types of packages not only on Fritsch Mikroplacer devices, but also on other repairing devices of this type.
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Bubliny na kapitálových trzích
Juračka, Martin
This bachelor thesis deals focus on speculative bubbles on the capital markets. The thesis is performed in theoretical and practical form. Theoretical part deals with the system of financial markets, structure of stock markets and with the theory of speculative bubbles. In practical part, there is introduced the Dot com bubble as the practical illustration of speculative bubble. The main part of this thesis and its goal is focused on possible occurrence of new speculative bubble, which would be similar to Dot com bubble from 2000.
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