National Repository of Grey Literature 4 records found  Search took 0.00 seconds. 
Planar LED Display Application
Houserek, Jiří ; Kosina, Petr (referee) ; Šandera, Josef (advisor)
This coursework deals theoretical with design and construction of the electronic clocks controlled by DCF77 signal, which is broadcasted from Germany. This device will be used as alarm and is able to show date. There is used display, which consists of 8x32 LED matrix in a modular, which is connected to main board over the edge. This device is controlled by microcontoller PIC16F887A. There are described displays, microcontrollers and DCF time signal.
Modeling of wirebonding technological steps for chip connection
Houserek, Jiří ; Kosina, Petr (referee) ; Psota, Boleslav (advisor)
This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.
Planar LED Display Application
Houserek, Jiří ; Kosina, Petr (referee) ; Šandera, Josef (advisor)
This coursework deals theoretical with design and construction of the electronic clocks controlled by DCF77 signal, which is broadcasted from Germany. This device will be used as alarm and is able to show date. There is used display, which consists of 8x32 LED matrix in a modular, which is connected to main board over the edge. This device is controlled by microcontoller PIC16F887A. There are described displays, microcontrollers and DCF time signal.
Modeling of wirebonding technological steps for chip connection
Houserek, Jiří ; Kosina, Petr (referee) ; Psota, Boleslav (advisor)
This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.

Interested in being notified about new results for this query?
Subscribe to the RSS feed.