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Properties of metal layers realized with vapour deposition
Milichovský, Miloš ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
This work deals with vacuum evaporation of metals, basic principles of this technology and exploring the properties of the resulting layer. It describes how vacuum evaporation works and its individual parts.The main part deals with evaporation of copper and other substances and the conductivity of the resulting film in relation to its thickness. As a parameter for measuring substrate temperature is specified.
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The influence of a pre-print thick layer paste viscosity on forming of layer
Ondráček, Michal ; Švecová, Olga (referee) ; Klíma, Martin (advisor)
This bachelor thesis deals with the theory of thick film technology and applying these layers. The work also includes basics of liquid rheology, methods of measurement viscosity and ways of mixing liquids. The main aim is to determine the influence of viscosity of thick film pastes for printing quality of the test structure using screen printing, in particular its flatness and sharpness. The aim is also measure the dependence of viscosity thick film pastes on mixing time.
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Characteristic measuremens of thick-film RC elements with distributed parameters
Kořínková, Ksenia ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The following work is focused on properties analysis of thick film RC elements with distributed parameters. The theoretical part offers projecting of RC elements, with their next realization. There are the following work parts: the resistance measurement and determination of the given resistances dependence scattering with different film number of the structures depending on their burning conditions. This bachelor's thesis is closed to the bachelor's work "Properties of Thick Film Multilayer Component".
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Modern Assembly for Microelectronic and Electronic Modules
Janík, Pavel ; Švecová, Olga (referee) ; Šandera, Josef (advisor)
Project is focused on describe modern assembly of microelectronic and electronic modules in electronic devices. Sense of the project is analyse reliability and inadequacies electronic devices assembled by modern technogies. Inadequacies modern technologies are impulse for design, implementation and testing new our way of assembly microelectronic modules. Main kind of materials which are used in this project are ceramics Al2O3 and printed circuit board FR4.
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Analysis of electrical properties of cardiac cells
Švecová, Olga ; Čmiel, Vratislav (referee) ; Šimurda, Jiří (advisor)
The diploma thesis is focused on the analysis of the electrical properties of the heart cells membranes. The main goal of this work is to answer to what extent it is possible to infer from experimental data on the detailed mechanism of interaction of substances with channels. The work also presents a detailed description of methods of measurement of membrane voltage and current, which are used in the experimental measurements. There are also discussed the individual channels of the cell membrane and ion currents, which arise as a response to the rectangular pulse voltage. There is also described the effect of various substances on the properties of ion currents flowing through the cell membrane.
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Reliability of Lead-free Solders and the Selected Methods to Estimate its Lifetime
Švecová, Olga ; Kolařík, Vladimír (referee) ; Urbánek,, Jan (referee) ; Šandera, Josef (advisor)
The doctoral thesis is focused on reliability of lead-free solder SAC 305. Knowledge in the field of fatigue models used in determining the lifetime of solder joints are observed in this thesis. Also such methods of predicting reliability as numerically-analytical methods or reliability experimental tests are mentioned. Practical results of reliability measurement are presented. Experimental data served as the foundation for determining empirical coefficients for the fatigue model based on deformation induced by creep of the solder, which was implemented in the ANSYS environment. Results from different methods were compared and conclusions discussing the suitability of the presented prediction methods are formulated.
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Research of the reliability of lead-free solder joints
Pelc, Miroslav ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints. The work is done selecting the most important factors entering into the soldering process. The method of the DOE sought the optimal combination of factors, which would correspond to the highest quality solder joints.
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Properties of Thick Film Multilayer Components
Shishkin, Alexey ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Purpose of our experiment to receive mathematical model for RC-RP elemets with different structure. As a objektive factor of mathematical model we will decide temperature coefficient of component's time constant. As a influence factors we'll choose production behaviour.To realize experimint for it. Number of factor's is three. After experiment to draw a conclusion about influence of poduction's error .
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Parameters of BGA-type interconnection joints ceramic Al2O3 substrates
Somer, Jakub ; Švecová, Olga (referee) ; Nicák, Michal (advisor)
This project deals with questions related to parameters of solder balls, used on BGA packages, on ceramic substrates. First part of this project contains general characteristic of solder balls, their properties and usage. In the following part there are described technologies and methods used during the experiment including the design of test substrate. The last part is dedicated to practical examination of compatibility of selected conductive pastes, solder pastes and fluxes during vapor reflow soldering. At the end of this work the selection of materials, assembly, soldering and microsections are described.
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