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TEM and SEM study of precipitation hardened Cu-Co alloys after severe plastic deformation
Buršík, Jiří ; Svoboda, Milan ; Král, Petr ; Dvořák, Jiří ; Sklenička, Václav
The paper reports on preliminary results of microstructural study of Cu-2wt.%Co alloy processed by ECAP. The experimental alloy was cast and annealed at 1273 K for 10 hours followed by water cooling, resulting in the solid solution (the initial state). Further heat treatment was then applied to produce two-phase material with fine distribution of precipitates. ECAP was then conducted at room temperature on both the initial and the precipitation hardened states. Resulting microstructures were studied and characterized by microhardness testing, TEM observations and texture analysis by means of electron backscatter diffraction (EBSD) technique in SEM.
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ANALYTICAL ELECTRON MICROSCOPY OF DILUTED CU–CO ALLOYS
Buršík, Jiří ; Svoboda, Milan
The work is focused on characterization of diluted model Cu–Co alloys with Co content from 2 to 4 wt.% after various thermal treatment. After initial annealing at 1273 K followed by water cooling, further annealing of the oversaturated solid solution in the range 773 to 1073 K generated a fine distribution of Co-rich precipitates. Parameters of microstructure were characterized by means of transmission electron microscopy with energy dispersive X-ray analysis.
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Microstructure Stability and Creep Behaviour of Alloys Processed by ECAP
Dvořák, Jiří ; Král, Petr ; Svoboda, Milan ; Kvapilová, Marie ; Sklenička, Václav
Coarse-grained binary Cu and Al alloys were processed by equal-channel angular pressing (ECAP) in order to evaluate the effect of severe plastic deformation on the thermal stability of resulting ultrafine-grained microstructure after ECAP followed by creep loading of the pressed alloys. ECAP was conducted at room temperature with a die that had an internal angle of 90° between the two parts of the channel. The subsequent extrusion passes were performed by route Bc. Microstructure of samples up to 12 ECAP passes was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter diffraction (EBSD) unit. Constant load creep tests in tension were performed at 0.3 - 0.5 Tm and at different applied stresses. It was found that the creep behaviour is influenced by high-angle grain boundaries created by ECAP and creep fracture occurred along the shear bands which are situated near shear plane of the last ECAP pass.
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Comparison of Creep Behaviour and Microstructural Changes in Electrodeposited Ultrafine-grained Nickel and its Particle-reinforced Nanocomposite
Kvapilová, Marie ; Sklenička, Václav ; Kuchařová, Květa ; Vidrich, G.
On the basic of the creep experimental results the paper reports comparison creep behaviour of electrodeposited ultrafine-grained nickel and its particle-reinforced nanocomposite. The objective of this research was to further improve the knowledge of the creep behaviour of monolithic nickel and to explore the role of nano-sized SiO2 particles in the potential creep strengthening of electrodeposited Ni nanocomposite. The creep behaviour and microstructure of the pure ultrafine-grained nickel and its nanocomposite reinforced by 2 vol.% nano-sized SiO2 particles were studied at temperatures in the range from 293 to 573 K and at the tensile stresses between 100 to 800 MPa. It was found that the creep resistance of the nanocomposite might be noticeably improved compared to the monolithic nickel. Possible creep mechanisms controlling the creep rate during the creep loading were discussed. The Coble creep as creep rate controlling mechanism was founded improbable.
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