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Wave Soldering Fluxes Comparison
Stoklásek, Lukáš ; Martinec, Petr (referee) ; Starý, Jiří (advisor)
Semestral thesis introduces the problematics of wave soldering fluxes, flux residues and problems of electromigration. Practical part describes measuring of ionic contamination by using conductometric method, measuring the wettability by the wetting balance method and amount of failures on wave soldered printed circuit boards with these fluxes. The main object is to compare quality of the fluxes.
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Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
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Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
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Lead-Free Voids Cause Mechanisms and Influence on Reliability
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this work is to analyze reliability of lead-free solder join, in particular the voids generated during the soldering process. The main target of the theoretical part of the work is to isolate basic mechanisms of formation of the voids and optimize the soldering process. The practical part of the paper is based on monitoring the count and size of the voids in a solder join. An X-Ray tomograph has been chosen as a non-destructive method of detection. The statistical part of this work compares conventional soldering of the entire board with local soldering by IR radiation.
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HAL Technology and Selected Parameters Influence on Quality
Jakub, Miroslav ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
Bachelor thesis describes and deals the problems of printed circuit boards production. It focuses on issues of process of lead – free HAL and influence of selected parameters on quality in production process GATEMA s.r.o. in Boskovice. Bachelor thesis contains analysis of PCB using microsection, optical microscopy and a sample of defects created during this process. Bachelor thesis presents on the test boards quality of solder mask developing, evaluates flux contamination with water, residual water on the PCB and it compares the PCB delay in liquid solder. It also determines the limit of non defective cover with the solder and determines the typical thickness of solder mask on the Cu pads and the ratio between the width of font and solder mask thickness.
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Electromigration of Flux Residues on PCB Surface
Tylich, Ondřej ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
Diploma thesis introduces the problems of electromigration, fluxes and flux residues. It includes a proposal for methods of measuring surface insulation resistance, information about selected types of fluxes and conformal coatings. It focuses on the influence of temperature, humidity. There are applied conductometric method and method of measuring SIR by IPC-25-B. The thesis describes the practical measurement of SIR and ionic contamination of PCB covered with flux and influence of RH, temperature and applied voltage is evaluated and discussed.
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Analysis of Aplication Flux and Solder Paste on PCB for BGA components
Toufar, Michal ; Řihák, Pavel (referee) ; Vala, Radek (advisor)
This thesis deals with rework of BGA components. There are described defects and errors in a solder joints. The current trend is focused on thin packages with fine pitch. It is assembled with smaller and smaller solder balls. It is described effect of different application of flux and solders paste for rework. The main part is focused on dipping and dispensing. These methods are suitable for repair process.
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Flux Residues after Reflow Soldering
Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
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Hot dip galvanizing of the steel construction
Pometlo, Stanislav ; Vyplašil, Evžen (referee) ; Kubíček, Jaroslav (advisor)
This master´s thesis deals with hot dip galvanizing of steel constructions and their protection from corrosion. This work describes the origin of corrosion of steel and its corrosion in different areas and presents degreasing and pickling before hot dip galvanization. It describes possibilities of making zinc layer by the wet and draw method of hot dip galvanization. Furthermore, it puts forward reactions between zinc and iron, possible defects of the zinc layer and influence of the hot dip galvanizing on the steel constructions. The experimental part examines the influence of the hydrogen charging on the material and the time of the flux operation on the quality of layer. The work further analyses the changing of mechanical properties of steels Hardox 500 and Weldox 700 as a result of the hydrogen embrittlement during pickling by the hydrochloric acid.
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Solder Wave Process Optimization
Procházka, Martin ; Brno, Martin Štěpánek HONEYWELL (referee) ; Starý, Jiří (advisor)
This work describes solder wave process and it‘s optimalization. It informs us about wave soldering and describes it’s fragments. Next it is described partition of fluxes and their properties. In practical part is described researching of defects on PCB’s and analysis of possible reason of defects, measurement of the weight of sprayed flux and measurement of solderable profile.
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