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Observation of high stressed hydrogenated carbon nitride films by SLEEM
Mikmeková, Eliška ; Müllerová, Ilona ; Sobota, Jaroslav
Two main factors can lead to losing adhesion in thin sputtered carbon nitride films: high residual stress and absorption of humidity. Basically, two different types of stress can be identified in thin films: compressive stress and tensile stress. Compressive stress can lead to wrinkling and film delamination, and tensile stress can cause the fracturing of thin films. For reactive sputtering of hydrogenated carbon nitride films, the compressive stress is typical. The films were prepared from graphite target (high purity, 99.9999 %) in mixture of nitrogen and hydrogen discharge.
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Surface examination of ultra-sharp cold field-emission cathode
Knápek, A. ; Brüstlová, J. ; Trčka, T. ; Klampár, M. ; Mikmeková, Šárka
An experimental cold field-emission cathode, based on metal-oxide-insulator structure has been analyzed by several non-destructive evaluation methods in order to describe the material properties and electrical behaviour of the sample. Owing to the fact that the tip of the cathode reaches nanoscopic-scale, several different evaluation methods have been incorporated. Firstly, the scanning electron microscopy (SEM), along with the electron dispersive spectroscopy (EDS) was performed to describe general proportions of the shape and the abundance of elements present in the surface layer. Secondly, the scanning low-energy electron microscopy (SLEEM) was applied in order to visualize the crystalline microstructure of the cathode surface. Finally, the epoxy coating covering the cathode tip was characterised using the dielectric relaxation spectroscopy (DRS) method.
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Imaging of thermal treated thin films on silicon substrate in the scanning low energy electron microscope
Zobačová, Jitka ; Mikmeková, Šárka ; Polčák, J. ; Frank, Luděk
Structure of thin films usually requires to be examined on microscopic level. The research topics like growth and stability of thin films, phase transitions and separation, crystallization, diffusion and defect formation has a need for LEED or XPS as techniques adequate for investigation of atomic transport processes on short length scales. The low energy electron microscopy is a complementary solution for imaging of samples with special concern for knowledge of surface physics and material science. In this contribution the microscopic examination of as-deposited and thermal treated thin films on Si substrates is performed.
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Superconductive property and microstructure of MgB2/Al composite materials
Matsuda, K. ; Mizutani, M. ; Nishimura, K. ; Kawabata, T. ; Hishinuma, Y. ; Aoyama, S. ; Müllerová, Ilona ; Frank, Luděk ; Ikeno, S.
Scanning low energy electron microscopy (SLEEM) is a useful tool for observation of insulating samples and determination of microstructure on a specimen surface. In the present work, we have applied the SLEEM to examine the microstructure contrast between boride particles and Al matrix.
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