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Insulating Properties of Flip Chip Structures
Dóczy, Robert ; Šandera, Josef (referee) ; Pulec, Jiří (advisor)
This work deals with the insulation properties of microelectronic structures. Specifically, insulation resistance of the gap that separates the conductive parts of the system. There are also described the influences, which have the effect on insulation resistance and the methods by which the insulation resistance is measured. There are also slightly described the issues of designing microelectronic packages and ways in which the microelectronic chip can be connected to the circuit. In the experimental part, the thesis deals with specific design of microelectronic structure such as flip-chip. Conductive pattern of this structure was made to allow the measurement of insulation resistance which depends on the application materials which were used in structure assembly. For this purpose, the structures also undergo a series of cleaning, whose influence is also discussed.
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Optimization of Cavity Fabrication in Low Temperature Co-fired Ceramics
Dóczy, Robert ; Somer, Jakub (referee) ; Štekovič, Michal (advisor)
This work deals with the fabrication of closed cavities in Low Temperature Co-Fired Ceramics (LTCC). In recent years, the LTCC ceramics have become widely used in the areas of sensors, MEMS and micro-fluidic applications. When fabricating such devices, it is important that the cavities maintain their compactness and dimensions after the manufacturing process . This is achieved primarily with the right choice of lamination process and its parameters and also by appropriate setting of the firing profile. The theoretical part describes the various steps in the production of LTCC structures and the most common technological processes used for creating structures with cavities and micro - channels . In the practical part are selected laminating procedures performed on the test pattern, which contains cavities of different sizes. Emphasis was placed on the correct execution of each method , while gradually modifying the lamination parameters. The achieved results are further discussed in terms of process parameters and their influence on the dimensions of manufactured cavities.
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Insulating Properties of Flip Chip Structures
Dóczy, Robert ; Šandera, Josef (referee) ; Pulec, Jiří (advisor)
This work deals with the insulation properties of microelectronic structures. Specifically, insulation resistance of the gap that separates the conductive parts of the system. There are also described the influences, which have the effect on insulation resistance and the methods by which the insulation resistance is measured. There are also slightly described the issues of designing microelectronic packages and ways in which the microelectronic chip can be connected to the circuit. In the experimental part, the thesis deals with specific design of microelectronic structure such as flip-chip. Conductive pattern of this structure was made to allow the measurement of insulation resistance which depends on the application materials which were used in structure assembly. For this purpose, the structures also undergo a series of cleaning, whose influence is also discussed.
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Optimization of Cavity Fabrication in Low Temperature Co-fired Ceramics
Dóczy, Robert ; Somer, Jakub (referee) ; Štekovič, Michal (advisor)
This work deals with the fabrication of closed cavities in Low Temperature Co-Fired Ceramics (LTCC). In recent years, the LTCC ceramics have become widely used in the areas of sensors, MEMS and micro-fluidic applications. When fabricating such devices, it is important that the cavities maintain their compactness and dimensions after the manufacturing process . This is achieved primarily with the right choice of lamination process and its parameters and also by appropriate setting of the firing profile. The theoretical part describes the various steps in the production of LTCC structures and the most common technological processes used for creating structures with cavities and micro - channels . In the practical part are selected laminating procedures performed on the test pattern, which contains cavities of different sizes. Emphasis was placed on the correct execution of each method , while gradually modifying the lamination parameters. The achieved results are further discussed in terms of process parameters and their influence on the dimensions of manufactured cavities.
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