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Analyse and Optimise Production Process of Prototypes
Hamr, Tomáš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This diploma thesis summarizes basic findings about issues of making development samples of PCB. The emphasis is especially on required quality which complies with mentioned norms. The theoretical section includes methodology for evaluating quality dismounted boards, assembling and soldering, parameters of components under different environmental circumstances. The practical part is carried out in cooperation with the department EEG in R&D Automotive Lighting Jihlava. It is dedicated to the design and the preparation of development samples where the quality is assessed according to given methodology from the theoretical part. PCB are analyzed by an X-ray, metallographic grinding and other methods. Recommendations are given and based on results for improvements.
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Test Equipment for Solder Joint Strength Measuring
Čechák, Ondřej ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This master thesis introduces the problematics of the tensile strength of soldered joints and the correlative mathematical formulas and the use of mentioned problematics in the technology of die shear/pull machines designed for the solder joint tensile strength measurement. It explains the importance and reasons for the use of this technology. The emphasis is then laid on the design and construction innovations of the current laboratory manual shear/pull measuring machine, its semi-automation and the possibility of utilizing the innovated system in a laboratory class of a subject on FEEC BUT.
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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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Temperature Profiles Measurement of SMD Packages
Strapko, Jaroslav ; Szendiuch, Ivan (referee) ; Starý, Jiří (advisor)
Diploma thesis mainly deals with temperature management and calculation of temperature profile in oven by using SMD packages (PLCC, 1206) of different thermal capacitance on testing PCB. Above all shows theoretical consecution of temperature profile calculation in oven by using known mathematical method like the lumped capacitance method or finite difference method. Theoretical solution and measured values are compared. Diploma thesis also deals with fixation methods of thermocouples K type on assembly, comparison methods based on known and subexperiment, determines the deficiencies of methods. This thesis can perform as theoretical as well as experimental resource to prediction of temperature profiles of PCB´s with different assembly density.
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Wave Soldering Fluxes Comparison
Stoklásek, Lukáš ; Martinec, Petr (referee) ; Starý, Jiří (advisor)
Semestral thesis introduces the problematics of wave soldering fluxes, flux residues and problems of electromigration. Practical part describes measuring of ionic contamination by using conductometric method, measuring the wettability by the wetting balance method and amount of failures on wave soldered printed circuit boards with these fluxes. The main object is to compare quality of the fluxes.
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Temperature Profiles Measurement of BGA Packages in Reflow Soldering
Tomčáková, Anna ; Bureš, Tomáš (referee) ; Starý, Jiří (advisor)
This graduation thesis addresses questions to thermal profile measurement of PBGA package during solder reflow process. The first part of thesis deals with problem of reflow process and reliability factors of solder joint connection. Next part analyses operation principles of thermocouples that are commonly used for temperature measurement. The experimental part deals with methods of thermocouples fixation during tests and measurements of dummy PBGA package. There was realized a method of dummy PBGA thermal profiles measurement and sample testing with and without simulated thermal load on PBGA package. The end of thesis concerns on possibilities of thermal profiles evaluation by using PWI method and thermal profile optimization of reflow process.
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