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Thermal simulation for space applications
Kostelník, Tomáš ; Maxa, Jiří (referee) ; Vyroubal, Petr (advisor)
This master´s thesis is focused on the problem of modelling heat transfer in Earth orbit. In the theoretical part, the main types of standard orbits are described, including terminology related to this issue. Furthermore, the subsystems of space probes are described with a focus on a specific description of their functions. The thesis also includes a discussion of the issues related to thermal management of space satellites, with a focus on multilayer insulation and thermal surface finishes. The work also includes a description of the various mechanisms of heat transfer in space, with a deeper focus on thermal radiation heat transfer, which is key in the context of this thesis. The experimental part is focused on the design of a calculator focused on the computation of radiation boundary conditions for different orbits of a space vehicle and their verification using a CFD solver on a model example of a cubesat.
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Integration of MHS into microsatellite for qualification mission
Macejko, Jakub ; Götthans, Jakub (referee) ; Götthans, Tomáš (advisor)
Tato diplomová práce se zabývá proveditelností demonstrační mise za použití CubeSatu, která by měla kvalifikovat miniaturizovaný tepelný spínač pro vesmírné aplikace. Studie posuzuje různé konfigurace CubeSatů od 1U do 3U se zaměřením na jejich schopnost provádět potřebné tepelné testy. Zjišťuje, že zatímco menší konfigurace poskytují nákladově efektivní testovací platformu, větší konfigurace nabízejí komplexní testovací možnosti.
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Emisivity and its Impact on the Heat Conductivity
Gančev, Jan ; Hejátková, Edita (referee) ; Szendiuch, Ivan (advisor)
This work deals with the issue of emissivity and its impact on the heat dissipation.The first part describes the basics of thermal management, the issue of emissivity and its measurement. In the second, experimental part, are dedicated the emissivity values of examined specimens. These values are then used as initial conditions for the thermal simulation. In the last part are compared the measured results and the simulated results and is evaluated the impact of emissivity for the heat dissipation.
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Optimization of the printed circuit board for power LED
Schenk, David ; Klíma, Martin (referee) ; Ing. Josef Vochyán, Ph.D., ALCZ Jihlava (advisor)
This diploma thesis deals with the problems of heat transfer on printed circuit boards. The first part consists of a theoretical analysis of the principles of conduction of heat in different environments, comparing the properties of common type’s base materials for PCBs in terms of thermal properties and focuses on heat transfer from the chip. In the following part they are general information about the program ANSYS ® Workbench ™. Next part consists of the basic designs of PCBs and their improving. PCBs thermal properties for different configurations are verified with calculations, simulations and practical measurements. In the last part there are created design recommendations for PCBs design based on the comparison of the results of initial proposals and proposals to improvements.
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Modern Trends in Vehicle Front Lights Design
Rada, Jakub ; Maršálek, Ondřej (referee) ; Raffai, Peter (advisor)
This bachelor’s thesis deals with the modern trends in the design of the headlamps. The first part presents the sequential stages of development of systems used for headlamps and their design solutions. The second part focuses on the possible cooling alternatives of functional parts in lighting modules, completed with the results of comparative laboratory tests performed by front manufacturers of automotive lighting. The final section contains a comparison of the currently most widely used technologies in the vehicle front lighting.
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Influence of temperature on light-technical parameters of LED
Sláma, Pavel ; Štěpánek, Jaroslav (referee) ; Pavelka, Tomáš (advisor)
This thesis deals with LEDs and how temperature influences their parameters. In the first part it is analyzed how semiconductors and semiconductor junctions work, which is fundamental for understanding mechanisms of diodes. Next up is description of electroluminescence and basic description of physical principles, on which it works. Following part is supposed to introduce reader to electro-technical parameters and powering possibilities of LEDs. Following chapter focuses on description of lightning-technical parameters. It aims to describe their meaning and their relation to LEDs. Next part is about influence of temperature. Firstly, it names the parameters which are altered by temperature change. Follows the description of thermal management and its influence on right behavior of LED diodes. The last part contains construction of measuring workplace for analyzing temperature influence on lightning-technical parameters of LEDs. Measurement of chosen electrical and lightning parameters follows up.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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Influence of temperature on light-technical parameters of LED
Sláma, Pavel ; Štěpánek, Jaroslav (referee) ; Pavelka, Tomáš (advisor)
This thesis deals with LEDs and how temperature influences their parameters. In the first part it is analyzed how semiconductors and semiconductor junctions work, which is fundamental for understanding mechanisms of diodes. Next up is description of electroluminescence and basic description of physical principles, on which it works. Following part is supposed to introduce reader to electro-technical parameters and powering possibilities of LEDs. Following chapter focuses on description of lightning-technical parameters. It aims to describe their meaning and their relation to LEDs. Next part is about influence of temperature. Firstly, it names the parameters which are altered by temperature change. Follows the description of thermal management and its influence on right behavior of LED diodes. The last part contains construction of measuring workplace for analyzing temperature influence on lightning-technical parameters of LEDs. Measurement of chosen electrical and lightning parameters follows up.
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Perspective materials for packaging
Gančev, Jan ; Psota, Boleslav (referee) ; Szendiuch, Ivan (advisor)
The first part of work deals with the theory of packaging of semiconductor chips and hybrid integrated circuits and defining material properties essential to the packaging. In the second, experimental part are defined the basic principles of heat transfer and heat dissipation of created package using thermocouple, thermal camera and static-thermal simulation. In the last part there is created design recommendations for package based on the comparison of the results.
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