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National Repository of Grey Literature 2 records found  Search took 0.01 seconds. 
Modeling of wirebonding technological steps for chip connection
 Houserek, Jiří ; Kosina, Petr (referee) ; Psota, Boleslav (advisor)
This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.
Detailed record
Modeling of wirebonding technological steps for chip connection
 Houserek, Jiří ; Kosina, Petr (referee) ; Psota, Boleslav (advisor)
This work deals with a theoretical analysis of contacting semiconductor chips using wire-bonding method. There are mentioned basic types of chips packages and their contacts. In the thesis is also described software Ansys. The number of the mechanical stress and deformation simulation within micro-wire during thermocompress process were made.
Detailed record

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