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STRUCTURAL, THERMODYNAMICS AND PHYSICAL PROPERTIES OF Zn Sn Al ALLOYS
Drápala, J. ; Musiol, J. ; Petlák, D. ; Vodárek, V. ; Smetana, B. ; Zlá, S. ; Kostiuková, G. ; Kroupa, Aleš ; Sidorov, V.E.
Some results of thermodynamic, structural and physical properties of Al-Sn-Zn alloys are presented in our paper. The ternary Al-Sn-Zn alloys were prepared in a resistance furnace in evacuated ampoules. The alloys were studied metallographically, their micro-hardness and X-ray micro-analysis (EDX, SEM) of individual phases were measured. Temperatures of phase transitions (liquidus, solidus, invariant reactions, etc.) were obtained using the DTA method (Setaram SETSYS 18 (TM)). The long time annealing (250, 300, 350 degrees C, 3, 7, 14 or 28 days) was used in order to achieve the thermodynamic equilibrium. The results were confronted with thermodynamic modelling of the ternary Al Sn Zn system in the Institute of Physics of Materials AS of the Czech Republic in Brno. We have studied density (by gamma-absorption method), electrical resistivity (by contactless method in rotating magnetic field) and magnetic susceptibility (by Faraday's method) of some Al-Sn-Zn alloys containing up to 10 at.% of aluminum and up to 65 at.% of zinc. The increasing of zinc content resulted in the decrease of the density and susceptibility values, except for one sample. The resistivity values practically didn't depend on the zinc content in the crystalline state, whereas a maximum was found for one of the samples in the liquid state. This work has been made in the frame of COST Action MP0602 project 'Advanced Solder Materials for High-Temperature Application'.
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Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
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Optimization of surface treatment of stainless steels
Mačátová, Lucie ; Žák, Ladislav (referee) ; Kubíček, Jaroslav (advisor)
The project deals with the processes of degreasing industry and testing new laser cleaning process, which has been experimentally verified and tested in the production process. Project also deals with soldering in general as a technology of joining metals. Included are the main components of the soldering, such as solder, flux, the types of connections and their use, ways of soldering and last but not least the soldering corrosion-resistant steel.
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Lead-Free Voids Cause Mechanisms and Influence on Reliability
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this work is to analyze reliability of lead-free solder join, in particular the voids generated during the soldering process. The main target of the theoretical part of the work is to isolate basic mechanisms of formation of the voids and optimize the soldering process. The practical part of the paper is based on monitoring the count and size of the voids in a solder join. An X-Ray tomograph has been chosen as a non-destructive method of detection. The statistical part of this work compares conventional soldering of the entire board with local soldering by IR radiation.
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Mechanical Properties of solder joint
Meliš, Josef ; Starý, Jiří (referee) ; Stejskal, Petr (advisor)
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes. The practical part of the thesis describes all the steps necessary to conduct the experiment. The experiment will evaluate the measured mechanical strength of the solder joint for each surface conditioning, the types of solders, the increase in thickness of the intermetalic layer during long-term aging and the change in the structure of the solder joint.
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QFN Packages Soldering and Technology Procedures
Jakub, Miroslav ; Brno, Petr Martinec, HONEYWELL (referee) ; Starý, Jiří (advisor)
This master´s thesis deals with QFN packages soldering and technology procedures optimization. The aim of theoretical part is description of QFN packages, their assembly and reflow soldering on PCB in HONEYWELL. The aim of the practical part is to propose a method of measuring temperature and optimizing the thermal profiles of selected PCB with QFN packages by using convection (HONEYWELL) and infrared (BUT) reflow ovens. Comparison and evaluation of thermal profiles for 3 production PCBś with QFN packages using solder paste AIM NC257-2 were realised. The main part of master´s thesis are appearance evaluation of solder joints, preparing microsection and measuring intermetallic layers thickness by using the optical and the scanning electron microscopes, analysation and study of QFN defects created during soldering proces. These tests were performed with 2 production PCB´s. Optimization of SPI and soldering technology procedures where were analyzed QFN packages were processed on one type of PCB. Interesting part of this diplomma thesis is creating of the 3D heat transfer model of QFN package during the reflow soldering in SolidWorks.
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Optimizing of QFN Package Assembly Process
Šváb, Martin ; Jankovský, Jaroslav (referee) ; Szendiuch, Ivan (advisor)
The Master thesis deals with technology of mounting QFN packages on to the printed circuits boards. Describes also influence of shape and size of soldering pads and the amount of soldering paste with respect to the quality and the reliability. In first part overview of existing packages is summarised. Second part describes design of testing board and the factors which leads to eliminating errors during manufacturing process.
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