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The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
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The via interconnection in LTCC
Sedliak, Erik ; Klíma, Martin (referee) ; Kosina, Petr (advisor)
This thesis deals with manufacturing process of LTCC 3D structures. Emphasis is placed mainly on the formation of via interconnections. In the second section of thesis, different via interconnections were designed, created and tested. Aim of this thesis was to evalute impact of via properties on vias function.
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Web Server for Protein Structure Prediction
Votroubek, Lukáš ; Očenášek, Pavel (referee) ; Burgetová, Ivana (advisor)
This work deals with proteins, especially with their structure and kinds of tertiary, or 3D, structure prediction. Tertiary structure prediction is very important for function prediction of this vitally important substance. Bioinformatics do this prediction much more effective and faster, because classical methods of structure prediction directly from molecule are very expensive and slow. On the other hand they are much more exact. Objective of this thesis is to describe tertiary structure prediction methods, describe used tools and possibility of automatic communication with them. Next objective is describe implementation of server, that will serve to protein engineers for more effective finding of information about tertiary structure from more servers without requesting each of them separately. Results of testing will be described in this work too.
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Pressure sensor made 3D structure
Hanus, Martin ; Pekárek, Jan (referee) ; Kosina, Petr (advisor)
This thesis deals with the points at issue of a 3D structure pressure sensor. The pressure sensor converts pressure into another physical quantity which is easier measure and which is processed subsequently. Usually ways of pressure sensing is for example capacitive, strain-gauge and optical. The 3D structures are constructed through the use of a LTCC technology, which can be laminated to create multi-layer structures, compared to standard high-temperature ceramics. Passive circuit components can be applied onto particular ceramic layers using either thin-layer or thick-layer technology. Practice part of thesis deals with several ways of construction a pressure sensor. First of all capacitive, strain-gauge and optical sensor and possible problems with construction individual sensors above all problems with lamination, cavity or burning
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Conducting connections of ceramic with FR4 in 3D structure
Pelc, Miroslav ; Adámek, Martin (referee) ; Kosina, Petr (advisor)
This work deals with conductive connections ceramic substrate with FR4 into three – dimensional structure. High frequency amplifier was created on ceramic substrate as a concrete application, for check quality substrate on resulting behavior circuit. The supply voltage for this amplifier is provided by the DC voltage source developed for FR4. Further the thesis deals with quality verification of substances conductive connection and individual aspects, with affect resulting reliability of connection.
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