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National Repository of Grey Literature 2 records found  Search took 0.00 seconds. 
Contamination in semiconductor fabrication
 Fojtášková, Helena ; Salyk, Ota (referee) ; Čech, Vladimír (advisor)
This bachelor thesis deals with contamination in the production of semiconductor substrates. It focuses on the efficiency and optimization of wet cleaning processes for monocrystalline silicon and silicon carbide semiconductor wafers. The thesis includes a literature research in the field of semiconductor manufacturing, wafer contamination and wafer cleaning processes. The most commonly studied metal contaminants include iron, copper and nickel, due to their high diffusivity, and therefore these elements were chosen for the experimental part. In the experimental part, wafers were prepared by targeted contamination to verify the effectiveness of the cleaning processes. Contamination analysis was performed using the vapour phase decomposition method combined with inductively coupled plasma mass spectrometry (VPD-ICP-MS) for silicon wafers and total reflection X-ray fluorescence (TXRF) for silicon carbide wafers. Based on the measurement results, the efficiency of the washing processes was evaluated and a procedure for process optimization was recommended.
Detailed record
Contamination in semiconductor fabrication
 Fojtášková, Helena ; Salyk, Ota (referee) ; Čech, Vladimír (advisor)
This bachelor thesis deals with contamination in the production of semiconductor substrates. It focuses on the efficiency and optimization of wet cleaning processes for monocrystalline silicon and silicon carbide semiconductor wafers. The thesis includes a literature research in the field of semiconductor manufacturing, wafer contamination and wafer cleaning processes. The most commonly studied metal contaminants include iron, copper and nickel, due to their high diffusivity, and therefore these elements were chosen for the experimental part. In the experimental part, wafers were prepared by targeted contamination to verify the effectiveness of the cleaning processes. Contamination analysis was performed using the vapour phase decomposition method combined with inductively coupled plasma mass spectrometry (VPD-ICP-MS) for silicon wafers and total reflection X-ray fluorescence (TXRF) for silicon carbide wafers. Based on the measurement results, the efficiency of the washing processes was evaluated and a procedure for process optimization was recommended.
Detailed record

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