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Analyse and Optimise Production Process of Prototypes
Hamr, Tomáš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This diploma thesis summarizes basic findings about issues of making development samples of PCB. The emphasis is especially on required quality which complies with mentioned norms. The theoretical section includes methodology for evaluating quality dismounted boards, assembling and soldering, parameters of components under different environmental circumstances. The practical part is carried out in cooperation with the department EEG in R&D Automotive Lighting Jihlava. It is dedicated to the design and the preparation of development samples where the quality is assessed according to given methodology from the theoretical part. PCB are analyzed by an X-ray, metallographic grinding and other methods. Recommendations are given and based on results for improvements.
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Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
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Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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Optimalization of power supply for LED light sources
Koždoň, Jakub ; Kosina, Petr (referee) ; Boušek, Jaroslav (advisor)
This work focuses on description of function, analysis of degradation process, measuring lifetime and design thermal and electrical driving circuit for LED. Lifetime power LED basically depends on their working temperature. So some methods for measuring and determine LED lifespan and impacts which affects their lifetime are going to be described. Driving circuits are one of keys of element lamps. Their characteristics can affect lifetime of all lamp. So some properties and impacts of circuits for driving LED's and their functions which are necessary need to know in design will be described . I'll also catalogue some circuits which are suitable for that and show particular design power supply for LEDs and it's realization.
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Application of graphite in thermal management of microelectronics
Havlíček, Václav ; Mačák, Martin (referee) ; Vyroubal, Petr (advisor)
Tato práce je zaměřena na zlepšení tepelného managementu mikroelektroniky implementací materiálů na bázi uhlíku, přesněji grafitových fólií, do tepelné architektury mikroelektroniky. Práce začíná vysvětlením současných metod chlazení a výzev v oblasti mikroelektroniky. Poté přechází k běžně používaným materiálům - hliníku a mědi a přidává do výběru i uhlíkové alotropie. Ve druhé části tato práce obsahuje několik příkladů použití pyrolytické grafitové fólie v tepelném managementu mikroelektroniky, prokazuje jeho použitelnost a analyzuje přínosy pro šíření tepla, tepelnou vodivost při dodržení elektrické izolace a možné využití ve flexibilní elektronice.
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Application of graphite in thermal management of microelectronics
Havlíček, Václav ; Mačák, Martin (referee) ; Vyroubal, Petr (advisor)
Tato práce je zaměřena na zlepšení tepelného managementu mikroelektroniky implementací materiálů na bázi uhlíku, přesněji grafitových fólií, do tepelné architektury mikroelektroniky. Práce začíná vysvětlením současných metod chlazení a výzev v oblasti mikroelektroniky. Poté přechází k běžně používaným materiálům - hliníku a mědi a přidává do výběru i uhlíkové alotropie. Ve druhé části tato práce obsahuje několik příkladů použití pyrolytické grafitové fólie v tepelném managementu mikroelektroniky, prokazuje jeho použitelnost a analyzuje přínosy pro šíření tepla, tepelnou vodivost při dodržení elektrické izolace a možné využití ve flexibilní elektronice.
|
|
|
Analyse and Optimise Production Process of Prototypes
Hamr, Tomáš ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This diploma thesis summarizes basic findings about issues of making development samples of PCB. The emphasis is especially on required quality which complies with mentioned norms. The theoretical section includes methodology for evaluating quality dismounted boards, assembling and soldering, parameters of components under different environmental circumstances. The practical part is carried out in cooperation with the department EEG in R&D Automotive Lighting Jihlava. It is dedicated to the design and the preparation of development samples where the quality is assessed according to given methodology from the theoretical part. PCB are analyzed by an X-ray, metallographic grinding and other methods. Recommendations are given and based on results for improvements.
|
|
|
Optimalization of power supply for LED light sources
Koždoň, Jakub ; Kosina, Petr (referee) ; Boušek, Jaroslav (advisor)
This work focuses on description of function, analysis of degradation process, measuring lifetime and design thermal and electrical driving circuit for LED. Lifetime power LED basically depends on their working temperature. So some methods for measuring and determine LED lifespan and impacts which affects their lifetime are going to be described. Driving circuits are one of keys of element lamps. Their characteristics can affect lifetime of all lamp. So some properties and impacts of circuits for driving LED's and their functions which are necessary need to know in design will be described . I'll also catalogue some circuits which are suitable for that and show particular design power supply for LEDs and it's realization.
|
|
|
Simulation of heat dissipation for power component
Sedlář, Tomáš ; Macháň, Ladislav (referee) ; Čožík, Ondřej (advisor)
The diploma thesis deals with the simulation of heat dissipation for LED Seoul SZ5-P. The heat transfer is discussed first. Further, the issue of thermal management and its design is analyzed. The dependence of LED junction temperature on area of single and double layer printed circuit board is simulated with Ansys Icepak. Additionally, influences of the number and placement of vias on the printed circuit board and aluminum substrate printed circuit board are simulated. Last but not least, the equations describing the dependence of printed circuit board area on desired LED junction temperature are derived. Finally, the values of heat transfer coefficient including convection and radiation are determined for various heat losses and junction temperatures.
|
|
|
Development in 3D Packaging for Modern Electronics Systems
Prikryl, Petr ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
The aim of this diploma thesis is 3D package design study and elaboration of rules for effective thermal and electrical design. There are recommendations and equations for calculating parameters affecting design of modern SOP and SIP packages mentioned in this thesis. Advantages of modern technologies in thermal management of packages are demonstrated in the second part of thesis using ANSYS workbench.
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