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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
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Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
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Non conventional applications of HIC´s
Grund, Pavel ; Švecová, Olga (referee) ; Szendiuch, Ivan (advisor)
Within the frame of this bachelor’s thesis was carried out given circuit, a capacitive probe. Topology was created during the semester project. The realized hybrid integrated circuit combines two technologies – thick film technology and surface mount technology using SMD components. The bachelor’s thesis is divided on the theoretical part, which contains a description of the theoretical design and production of hybrid integrated circuit, also owns a design capacitive probe in hybrid form with a selection of components and calculates the size of the substrate thick film resistors, and a practical part. The practical part is described in detail the production of our HIC, including verification of functionality.
|
|
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Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
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